Read Microsoft PowerPoint - 3 - INACKER ACI-LMCO LFS Rapid Responce text version

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

LEAD FREE SOLDERING RAPID RESPONSE PROJECT July 13, 2005

1

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Lead Free Rapid Response Agenda

· Manufacturing Process Site Survey

­ T. DeStefano, Lockheed Martin

·

Manufacturing Lead Free Pilot Build

­ L. Whiteman, ACI

·

Manufacturing Lead Free Pilot Evaluation

­ L. Whiteman, ACI

·

Conclusions

­ L. Whiteman, ACI

·

Future Plans

­ L. Whiteman, ACI

2

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

Manufacturing Site Survey

3

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Manufacturing Process Site Survey Scope Objectives

­ To determine degree of current LM Moorestown manufacturing process and equipment compatibility with Lead Free Soldering ­ Identify areas of concern ­ Provide Recommendations / Gap Analysis to align processes for future Lead Free compatibility

·

Manufacturing Processes Investigated

­ ­ ­ ­ ­ ­ ­ ­ ­ Screen Printing Component Placement Reflow (Surface Mount) Soldering Hand Soldering Dip Tinning Selective Soldering Hot Bar Soldering Wave Soldering Rework / Repair

4

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Materials Used In Evaluation

­ Solder paste: Alpha Metals OM-338 - 96.5Sn / 3.0Ag / 0.5Cu

· Same flux as present UP-78 Sn63/Pb37 no-clean solder paste

­ Solder wire: Alpha Metals OM-338 - 96.5Sn / 3.0Ag / 0.5Cu

· Same flux as present Sn63/Pb37 wire solder

­ Paste Flux; Alpha Metals UP-78 No-clean

· Used for Hot bar soldering and rework

·

PWB Types And Finishes Used In Evaluation

­ FR-4 with Electroless Nickel Emersion Gold (ENIG) finish ­ FR-4 with Hot Air Solder Level (HASL) finish ­ Ceramic substrate with Platinum / Gold thick film ink finish

5

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· SMT Equipment

­ Stencil Printers; Dek 265GX and Dek 265 Horizon

· Fully automatic with PWB to stencil optical alignment · The print performance was equal to the present process · No process adjustments are required

6

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· SMT Equipment

­ Component placement: Mydata My15 and Mydata Tp18 ­ Fully automatic

· With PWB optical and component optical/ mechanical alignment

­ The pick and place performance equivalent to present process. ­ No process adjustments are required.

7

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· SMT Reflow Soldering Equipment

­ Solder Reflow; BTU VIP-98

· Seven zone convection oven with nitrogen reflow and two chiller zones · Thermal profile adjusted

­ From 210 ± 10 oC to 240 ± 10 oC ­ Same conveyor speed used ­ no cycle time effect.

· Zone 7 adjusted to its maximum capable temperature 300 oC

­ Will cause zone temperature alarms, reduced heater and fan life

· Equipment capable but not optimum

8

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· SMT Reflow Soldering Equipment

­ Existing Equipment Options

· Operate at lower conveyor speed · Oven modifications to better support Lead Free Soldering

­ Recommend 400 oC maximum zone temperature capability on any new reflow ovens purchased. ­ ACI Capabilities: BTU Paragon 98

· Updated version of VIP-98

­ Maximum capable temperature 400oC

· Available to support any additional process development and trials

9

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· SMT Reflow Soldering SnAgCu Thermal Profile

­ FR4 Assembly

10

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· SMT Reflow Soldering SnAgCu Thermal Profile

­ Ceramic Module

11

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· SMT Aqueous Cleaning Equipment

­ Flux Removal: Electrovert AS200 Aqueous Cleaner

· Wash section has maximum pressure and manifold capability · The wash and dry performance was equal to the present process · No process adjustments are required

12

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Hand Soldering; Hako Solder Stations

­ Interchangeable tip cartridges with 850oF maximum temperature ­ The equipment capability is adequate for the process.

· The nominal tip temperature required increase from 700oF to 750oF · The flux core present in the wire solder was not adequate

­ Additional paste flux required to achieve adequate wetting and reduce solder oxidation

· Recommend preheating the PWA between 100oF to 125oF

­ Prevent thermal shock and prevent pad lift by minimizing the solder tip contact time

13

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Selective Soldering; Air-Vac

­ Dynamic solder pot capable of 600oF / 316oC

· Using interchangeable solder towers · Solder pot temperature increased

­ From 500oF / 260oC to 530oF / 277oC

­ Can support Lead Free Solders

14

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Selective Soldering; Air-Vac

­ Lead Free solders can deteriorate fixtures

· Solder pumps stainless steel impeller and impeller shaft · Solder pot inner lining causing holes · Depends upon usage

·

Recommendations

­ Consider upgrade or replacement of solder pots and fixtures ­ Nitrogen blanket suggested

· To improve wetting and solder joint appearance.

Example of Solder Pot Failure

15

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Electrovert Wave Solder Machine

­ Solder pot temperature increased from 500oF to 530oF ­ High tin content SAC solder material issues

· Will deteriorate the pump impellers and solder pot inner lining

­ A nitrogen gas blanket is required

· Reduce dross · Enhance wetting

­ Recommend equipment upgrade or replacement

16

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Component Rework Stations; Air-Vac DRS24 and DRS22

­ DRS24

· Automatic Nitrogen hot air, component removal and replacement.

­ DRS22

· Manual Nitrogen hot air, component removal and replacement.

17

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Component Rework Stations; Air-Vac DRS24 and DRS22

­ The hot air reflow temperature increased from 350oF to 400oF ­ The hot air bottom side preheat temperature

· Increased from 125 oC to 175 oC. · Maximum heater capacity

­ Top side: 420oF / 216 oC ­ Bottom side: 200oF / 93 oC

­ Increased process time

· To reach the proper preheat and reflow temperatures.

­ No equipment upgrade or replacement is necessary

18

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Hot Bar Soldering; Hughes HTT-1000

­ Semi-automatic profile programmable bar solder.

· The profile required adjustment

­ Increase the solder reflow temperature from 210oC to 240oC

· Same preheat and soak temperature and time

­ No cycle time effect.

19

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Dip Tinning; Solder pots

­ Static solder pot capable of 800oF.

· Solder pot temperature was increased from 500oF to 530oF

­ Lead Free solders can deteriorate fixtures

· Solder pumps stainless steel impeller and impeller shaft · Solder pot inner lining causing holes · Depends upon usage

·

Recommendations

­ Consider upgrade or replacement of solder pots and fixtures

Example of Solder Pot Failure

20

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Site Survey Solder Results

­ PWB FR-4: substrate with ENIG finish ­ Component: CQFP 144 with Sn/Pb lead finish ­ Solder: SnAgCu paste

·

Solder Joint Meets IPC-J-STD 001C Class 3 Requirements

­ Fillet wetting to lead/ land is good ­ Heal fillets are good ­ Joint shows no signs of thermal stress.

21

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Site Survey Solder Results

­ ­ ­ ­ PWB - Ceramic substrate with Platinum/ Gold thick film ink finish. Component ­ LCC 20 with SnAgCu Lead Finish. Component ­ Plastic Electrolytic capacitor with Sn Lead Finish. Solder: SnAgCu paste. Lockheed Martin Ceramic Module Platinum / Gold Thick Film Solder Paste: SnAgCu

22

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Process Site Survey

· Solder Joint Meets IPC-J-STD 001C Class 3 Requirements

­ ­ ­ ­ ­ Fillet wetting to lead / land is good Fillets are good Joint shows no signs of thermal stress Joints exhibit a dull grainy surface Wetting angle is increased restricting flow to the pad edge

·

Process Feasible But Requires Optimization

23

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

Manufacturing Lead Free Pilot Build

24

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Lead Free Pilot Build

· Assembly Description

­ Assembly number 20512895

· Single sided SEM B module. · FR-4 Multi layer PWB with a Sn63/Pb37 HASL finish. · 78 chip components

­ Quantity 72; 1210 resistors with 90% tin / 10% lead, lead finish ­ Quantity 6; 1210 capacitors with 100% tin over nickel lead finish ­ Quantity 1; 100 pin SEM connector with Sn63/Pb37 lead finish

­ Quantity Built: 3

Terminator Module

Chip Components

25

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Lead Free Pilot Build

· Assembly Description

­ Multiple bond types will determine the reliability of the SnAgCu 305 solder attachment to Tin and different percentages of Sn/Pb. ­ Solder bond descriptions

· · · · SnAgCu solder bonded to Sn90/Pb10 lead. SnAgCu solder bonded to Sn100 lead. SnAgCu solder bonded to Sn63/Pb37 lead. SnAgCu solder bonded to Sn63/Pb37 PWB pad.

Terminator Module

Chip Components

26

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Lead Free Pilot Build

· Solder Joint Meets IPC-J-STD 001C Class 3 Requirements

Circumferential Wetting On Primary Side: 270o Vertical Solder Fill: 75% Circumferential Wetting on Secondary Side: 330o Percentage of land area covered with wetted solder on solder primary side: 0% ­ Percentage of land area covered with wetted solder on secondary side: 75% ­ ­ ­ ­

· Voids are permitted if solder joint meets these requirements

Chip Component SnPb Solder SnPb Component

Chip Component SnAgCu Solder SnPb Component

Chip Component SnAgCu Solder SnAgCu Component

27

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Lead Free Pilot Evaluation

· Site Survey Solder Results

­ Terminator Module ­ PWB FR-4: Substrate with Sn63/Pb37 HASL finish. ­ Solder: SnAgCu paste

·

Solder Joint Meets IPC J-STD 001C Class 3 Requirements

­ Fillet wetting to lead/ land is good ­ Joint shows no signs of thermal stress

Resistors with Sn90 / Pb10 finish.

Connector with Sn63 / Pb37 finish

Capacitor with Sn100 finish

28

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Lead Free Pilot Evaluation

· PWB - FR-4 Substrate With Sn63/Pb37 HASL Finish.

­ Terminator Module ­ Typical voiding associated with solder reflow

Resistors with Sn90 / Pb10 finish

Capacitor with Sn100 finish

29

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

Manufacturing Lead Free Soldering Pilot Evaluation

30

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Lead Free Pilot Evaluation

· Terminator Board Test Schedule

­ PWA #1 - Cut in half

· X-ray: To determine presents or absence of voids · 1st half: Cross section to determine inter-metallic bond · 2nd half: Thermal cycle -55oC to 125oC; 100 cycles

­ Dwell 10 minutes

­ PWA #2 ­ Full board

· X-ray: To determine presents or absence of voids. · Thermal cycle -55oC to 125oC; 100 cycles

­ Dwell 10 minutes

· Passed production functional test

­ PWA #3 ­ Full board

· X-ray: To determine presents or absence of voids. · Attach to frame then production functional test. · ESS test -40oC to 80oC; 10 cycles

­ Dwell 10 minutes

· Passed production functional test

31

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Lead Free Pilot Evaluation

· Unstressed Solder Joints

­ SnCu Intermetallic: 3 µm

· Solder / Pad Interface

­ NiSn Intermetallic

· Component / Solder Interface · Measured 0.5 to 0.75 µm

­ No cracks / separations detected

· Minimum voiding found at interfaces

Unstressed Solder Joint

·

Stressed Solder Joints

­ SnCu Intermetallic: 3.5 µm

· Solder / Pad Interface

­ NiSn Intermetallic

· Component / Solder Interface · Measured 0.5 to 0.75 µm

VOIDS

­ No cracks / separations detected ­ Voids found at interfaces: ~ 60

Stressed Solder Joint

32

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Manufacturing Lead Free Pilot Evaluation

· Unstressed Solder Joints

Nickel Solder Micro-voids SnCu Intermetallic

Unstressed Component Interface

Unstressed Pad Interface

·

Stressed Solder Joints

Nickel Solder CuSn

CuSn

Stressed Component Interface

Stressed Pad Interface

33

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

Conclusions

34

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Rapid Response Conclusions

· Manufacturing Process Site Survey

­ Lockheed Martin is capable of building Lead Free Hardware ­ Process Improvements / Optimization

· Upgrade SMT Reflow Soldering equipment when replaced. · Upgrade wave soldering unit when replaced.

·

Manufacturing Lead Free Pilot Build

­ Successfully built several devices

· Terminator Module · Non-functional Ceramic and FR4 Boards · Non-functional Phase Shifter Driver

·

Manufacturing Lead Free Pilot Evaluation

­ Terminator Module passes electrical and thermal cycling tests

· Caveat: Terminator Module comprised of non-active components

35

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

Future Plans

36

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Proposed Lockheed Martin Lead Free Activities

· Updated Phase Shifter Driver (PSD) Production Build

­ ­ ­ ­ ­ Build several units Perform functional electrical testing Perform environmental qual testing (leverage redesign) Certify Lead Free PSD unit Part of original Lockheed Martin Rapid Response plan

37

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

- Proposed Lockheed Martin Lead Free Activities

· Build DV (PPM) Unit With Lead Free Solders

­ Utilizing ACI's Demonstration Factory

· Can transition process to Lockheed Martin

­ Perform functional electrical testing ­ Perform ESS testing ­ Certify Lead Free DV (PPM) unit

·

Part Of Developing Naval Lead Free Process Specification

­ Directed by ACI and Industrial Advisory Board

38

LEAD FREE SOLDERING RAPID RESPONSE PROJECT

Questions / Discussions

39

Information

Microsoft PowerPoint - 3 - INACKER ACI-LMCO LFS Rapid Responce

39 pages

Find more like this

Report File (DMCA)

Our content is added by our users. We aim to remove reported files within 1 working day. Please use this link to notify us:

Report this file as copyright or inappropriate

563215