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APL3510/1

USB Power-Distribution Switches

Features

· · · · · · · · · ·

70m (MSOP-8) High Side MOSFET Wide Supply Voltage Range: 2.7V to 5.5V Current-Limit and Short-Circuit Protections Over-Temperature Protection Fault Indication Output Enable Input UL Approved-File No. E328191 Nemko IEC 60950-1: 2005 (2nd Edition) and EN 60950-1: 2006 CB_Scheme Certified, No.52719 TUV IEC 60950-1: 2005(2nd Edition) and EN 609501: 2006 Certified, No.44 780 09 377124 Lead Free and Green Devices Available (RoHS Compliant)

General Description

The APL3510/1 series of power switches are designed for USB applications. The 70m N-channel MOSFET power switch satisfies the voltage drop requirements of USB specification. The protection features include current-limit protection, short-circuit protection, and over-temperature protection. The device limits the output current at current limit threshold level. When VOUT drops below VIN-1V, the devices limit the current to a lower and safe level. The over-temperature protection limits the junction temperature below 140oC in case of short circuit or over load conditions. Other features include a deglitched OCB output to indicate the fault condition and an enable input to enable or disable the device.

Simplified Application Circuit

5V VIN VOUT USB Port

Applications

· · ·

Notebook and Desktop Computers USB Ports High-Side Power Protection Switchs

APL3510A/B/C/D/E/F APL3511A/B/C/D USB Controller OCB EN/ENB

GND

Pin Configurations

GND 1 VIN 2 VIN 3 EN 4 8 VOUT 7 VOUT 6 VOUT 5 OCB

OCB 1 GND 2 EN 3

5 VOUT

VOUT 1 GND 2

5 VIN

4 VIN

OCB 3

4 EN

SOP-8/MSOP-8 APL3510A/C (Top View)

SOT-23-5 APL3510A/C/E (Top View)

SOT-23-5 APL3511A/C (Top View)

GND 1 VIN 2 VIN 3 ENB 4 SOP-8/MSOP-8 APL3510B/D (Top View)

8 VOUT 7 VOUT 6 VOUT 5 OCB

OCB 1 GND 2 ENB 3

5 VOUT

VOUT 1 GND 2

5 VIN

4 VIN

OCB 3

4 ENB

SOT-23-5 APL3510B/D/F (Top View)

SOT-23-5 APL3511B/D (Top View)

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright © ANPEC Electronics Corp. Rev. A.6 - Dec., 2009 1 www.anpec.com.tw

APL3510/1

Ordering and Marking Information

APL3510 APL3511 Package Code K : SOP-8 X : MSOP-8 B : SOT-23-5 Operating Ambient Temperature Range Assembly Material I : -40 to 85 oC Handling Code Handling Code TR : Tape & Reel Temperature Range Output Current/EN Function Package Code A : 2A/Active High B : 2A/Active Low C : 1A/Active High Output Current/EN Function D : 1A/Active Low E : 0.3A/Active High F : 0.3A/Active Low Assembly Material G : Halogen and Lead Free Device APL3510A XXXXX L510A XXX XX L0AX L1AX

APL3510A K:

XXXXX - Date Code

APL3510A X:

XXXXX - Date Code

APL3510A B: APL3511A B:

X - Date Code X - Date Code

Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).

Absolute Maximum Ratings

Symbol VIN VOUT VENB, VEN VOCB TJ TSTG TSDR VIN Input Voltage (VIN to GND) VOUT to GND Voltage EN, ENB to GND Voltage OCB to GND Voltage Maximum Junction Temperature Storage Temperature

(Note 1)

Rating -0.3 ~ 7 -0.3 ~ 7 -0.3 ~ 7 -0.3 ~ 7 150 -65 ~ 150 260 Unit V V V V

o o o

Parameter

C

C C

Maximum Lead Soldering Temperature, 10 Seconds

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol JA Parameter Junction-to-Ambient Resistance in Free Air

(Note 2)

Typical Value SOP-8 MSOP-8 SOT-23-5 160 160 235

Unit

o

C/W

Note 2 : JA is measured with the component mounted on a high effective thermal conductivity test board in free air.

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APL3510/1

Recommended Operating Conditions (Note 3)

Symbol VIN IOUT VIN Input Voltage OUT Output Current (APL3510A/B, APL3511A/B) OUT Output Current (APL3510C/D, APL3511C/D) OUT Output Current (APL3510E/F) TA TJ Ambient Temperature Junction Temperature Parameter Range 2.7 ~ 5.5 0 ~2 0 ~1 0 ~0.3 -40 ~ 85 -40 ~ 125

o o

Unit V

A

C

C

Note 3 : Refer to the typical application circuit

Electrical Characteristics

Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC. Symbol SUPPLY CURRENT VIN Supply Current Leakage Current Reverse Leakage Current POWER SWITCH SOP-8 Package RDS(ON) Power Switch On Resistance IOUT=1.5A, TA= 25 oC SOT-23-5 Package MSOP-8 Package UNDER-VOLTAGE LOCKOUT (UVLO) VIN UVLO Threshold Voltage VIN UVLO Hysteresis CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS ILIM Current Limit Threshold APL3510A/B, APL3511A/B, VIN=2.7V to 5.5V, TA= -40 ~ 85 oC APL3510C/D, APL3511C/D, VIN=2.7V to 5.5V, TA= -40 ~ 85 oC APL3510E/F, VIN=2.7V to 5.5V, TA= -40 ~ 85 oC ISHORT Short-Circuit Output Current APL3510A/B, APL3511A/B, VIN=2.7V to 5.5V APL3510C/D, APL3511C/D, VIN=2.7V to 5.5V APL3510E/F, VIN=2.7V to 5.5V 2.1 1.1 0.35 0.35 2.5 1.5 0.8 0.8 2.9 1.9 0.7 0.7 A A A A A A VIN rising, TA= -40 ~ 85 oC 1.7 0.2 2.65 V V 80 75 70 90 90 90 m No load, VEN=0V or VENB=5V No load, VEN=5V or VENB=0V VOUT=GND, VEN=0V or VENB=5V VIN=GND, VOUT=5V, VEN=0V or VENB=5V 65 1 100 1 1 µA µA µA µA Parameter Test Conditions Min. APL3510/1 Typ. Max. Unit

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APL3510/1

Electrical Characteristics (Cont.)

Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC.

Symbol OCB OUTPUT PIN

Parameter

Test Conditions Min.

APL3510/1 Typ. Max.

Unit

OCB Output Low Voltage OCB Leakage Current tD(OCB) OCB Deglitch Time

IOCB=5mA VOCB=5V OCB assertion, TA= -40 ~ 85 oC

5

0.2 12

0.4 1 20

V µA ms

EN OR ENB INPUT PIN VIH VIL Input Logic HIGH Input Logic LOW Input Current VOUT Discharge Resistance tD(ON) tD(OFF) tSS Turn On Delay Time Turn Off Delay Time Soft-Start Time No load, COUT=1µF, VIN=5V VEN=0V or VENB=5V VIN=2.7V to 5V VIN=2.7V to 5V 2 150 30 30 400 0.8 1 V V µA µs µs µs °C °C

OVER-TEMPERATURE PROTECTION (OTP) TOTP Over-Temperature Threshold Over-Temperature Hysteresis TJ rising 140 20 -

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APL3510/1

Typical Operating Characteristics

Switch On Resistance vs. Junction Temperature

160 Switch On Resistance, RDS(on) (m) 140 120 100 80 60 40 20 0 -50 0 50 100 Junction Temperature ( oC) 150

MSOP8 SOT-23-5 SOP8

Switch On Resistance vs. Input Voltage

130 Switch On Resistance, RDS(on) (m) 120 110 100

SOP8

VIN =5V, IOUT =1.5A, CIN =1µF/X7R, COUT =10µF/X7R

IOUT =1.5A, CIN =1µF/X7R, COUT =10µF/ X7R, TA=25oC

90 80 70 60 50 2.5 3.0 3.5 4.0 4.5 Input Voltage (V) 5.0 5.5

MSOP8 SOT-23-5

Supply Current vs. Junction Temperature

100 80

60 55

Supply Current vs. Input Voltage

Supply Current, ICC (µA)

Supply Current, ICC (µA)

50 45 40 35 30 25 20 RLOAD = Open, CIN =COUT =33µF/Electrolytic, TA ¢J =25 2.5 3.0 3.5 4.0 4.5 Input Voltage (V) 5.0 5.5

60

40

20 VIN =5V, RLOAD = Open, CIN =COUT =33µF/Electrolytic -50 0 50 100 Junction Temperature ( oC) 150

0

Current Limit Threshold vs. Junction Temperature

3.0 Current Limit Threshold, ILIM (A) 2.5 2.0 1.5 APL3510C/D 1.0 0.5 VIN =5V 0.0 -50 0 50 100 (oC) 150 APL3510A/B

Current Limit Threshold vs. Input Voltage

2.8 Current Limit Threshold, ILIM (A) 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 2.5 TA =25oC 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage (V) APL3510C/D APL3510A/B

Junction Temperature

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APL3510/1

Typical Operating Characteristics (Cont.)

Current-Limit Response vs. Output Peak Current

300 Current-Limit Response (µs) Current-Limit Response (µs) 250 200 150 100 50 0 0 2 4 6 8 10 12 Output Peak Current (A) APL3510A/B, VIN = 5V, TA=25oC 250

Current-Limit Response vs. Output Peak Current

APL3510C/D, VIN = 5V, TA=25oC

200

150

100

50

0 0 2 4 6 8 10 12 Output Peak Current (A)

Short-Circuit Output Current vs. Input Voltage

Short-Circuit Output Current, ISHORT (A) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 2.5

EN Pin Threshold Voltage vs. Junction Temperature

3.0 EN Pin Threshold Voltage, VEN (V)

VIN = 5V, TA=25oC

2.5

2.0

EN Rising

1.5

EN Falling

1.0 RLOAD =50, CIN = COUT =33µF/Elctrolytic 0.5 -50 0 50 100 Junction Temperature ( oC) 150

3.0

3.5 4.0 4.5 Input Voltage (V)

5.0

5.5

2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 2.5

EN Pin Threshold Voltage vs. Input Voltage

Turn-Off Leakage Current, ILEAK (µA)

Turn-Off Leakage Current vs. Junction Temperature

4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 0 50 100 150 VIN =5V, Shut-Down mode, R LOAD =0, CIN = COUT =33µF/Elctrolytic

EN Pin Threshold Voltage, VEN (V)

EN Rising

EN Falling

VIN =5V, RLOAD =50, CIN = COUT =33µF/Elctrolytic, TA=25oC 3.0 3.5 4.0 4.5 5.0 5.5

Input Voltage (V)

Junction Temperature ( oC)

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APL3510/1

Typical Operating Characteristics (Cont.)

Switch Off Supply Current vs. Junction Temperature

4.0 Switch Off Supply Current, ICC(off)(µA) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 0 50 100 150

18 OCB Deglitch Time, TD(OCB) (ms) 17 16 15 14 13 12 11 10 9

OCB Deglitch Time vs. Junction Temperature

VIN = 5V, RLOAD = Open, CIN = COUT =33µF/Elctrolytic

RLOAD =1, CIN = COUT =33µF/Elctrolytic -50 0 50 100 150

Junction Temperature ( oC)

Junction Temperature ( oC)

OCB Deglitch Time vs. Input Voltage

18 OCB Deglitch Time, TD(OCB) (ms) 17 16 15 14 13 12 11 10 9 2.5 RLOAD =1, CIN = COUT =33µF/Elctrolytic 3.0 3.5 4.0 4.5 5.0 5.5

UVLO Threshold Voltage, VUVLO (V) 3.2 2.8

UVLO Threshold Voltage vs. Junction Temperature

UVLO Rising 2.4 2.0 1.6 1.2 0.8 -50 0 50 100 150 Junction Temperature ( oC) UVLO Falling

IOUT =15mA, CIN = COUT =33µF/Elctrolytic

Input Voltage (V)

Turn-Off Falling Time vs. Junction Temperature

200 Turn-Off Falling Time, tF (µs)

Turn-On Rising Time vs. Junction Temperature

700 Turn-On Rising Time, tR (µs) 600 500 400 300 200 100 0 VIN = 5V, RLOAD =30, CIN = 33µF/Elctrolytic, C OUT =1µF/X7R

VIN = 5V, RLOAD =30, CIN = 33µF/Elctrolytic, COUT =1µF/X7R 150

100

50

0 -50 0 50 100 ( oC) 150 Junction Temperature

-50

0

50

100 ( oC)

150

Junction Temperature

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APL3510/1

Typical Operating Characteristics (Cont.)

Output Voltage vs. Output Current

6 5 4 3 2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Output Current (A)

Output Voltage vs. Output Current

6 APL3510C/D, VIN = 5V, TA=25oC

APL3510A/B, VIN = 5V, TA=25oC

Output Voltage, VOUT (V)

Output Voltage, VOUT (V)

5 4 3 2 1 0 0.0 0.5 1.0

1.5

2.0

Output Current (A)

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APL3510/1

Operating Waveforms

The test condition is VIN=5V, TA= 25oC unless otherwise specified.

Turn On Response

Turn Off Response

VENB 1 V ENB

1

V OUT

VOUT 2 2

VIN =5V, RLOAD =30, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VENB, 5V/Div, DC CH2: VOUT, 2V/Div, DC TIME: 200µs/Div

VIN =5V, RLOAD =30, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VENB, 5V/Div, DC CH2: VOUT, 2V/Div, DC TIME: 100µs/Div

UVLO at Rising

UVLO at Falling

VIN

V OUT VIN

1 VOUT 2

1 2

VIN =5V, RLOAD =30, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VIN, 1V/Div, DC CH2: VOUT, 1V/Div, DC TIME:2ms/Div

VIN =5V, RLOAD =30, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VIN, 1V/Div, DC CH2: VOUT, 1V/Div, DC TIME:5ms/Div

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APL3510/1

Operating Waveforms (Cont.)

The test condition is VIN=5V, TA= 25oC unless otherwise specified.

OCB Response During Short Circuit

OCB Response During Over Load

VB A T

VE N B

V ENB

1 VOCB

1

V CHRIN

V OCB

2

2

IOUT 3 3

IOUT

VIN =5V, RLOAD =0, CIN =COUT=33µF/ Electrolytic CH1: VENB, 5V/Div, DC CH2: VOCB, 5V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 5ms/Div

VIN =5V, RLOAD =2, CIN =COUT=33µF/ Electrolytic CH1: VENB, 5V/Div, DC CH2: VOCB, 5V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 5ms/Div

OCB Response with Ramped Load

V OCB

Load-Transient Response

VOUT

2 VOUT

1

IOUT 3

1 2

IOUT

VIN =5V, CIN =COUT=33µF/Electrolytic CH1: VOUT, 5V/Div, DC CH2: VOCB, 5V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 2ms/Div

VIN =5V, RLOAD =1k to 2.2, CIN =COUT=33µF/ Electrolytic CH1: VOUT, 1V/Div, DC CH2: IOUT, 1A/Div, DC TIME: 1ms/Div

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APL3510/1

Pin Description

PIN NO. SOT-23-5 SOP-8/ MSOP-8 APL3510 APL3511 1 2 3 2 4 2 5 NAME FUNCTION

GND VIN EN (A/C/E) ENB (B/D/F) OCB

Ground. Power Supply Input. Connect this pin to external DC supply. Enable Input. Pulling this pin to high will enable the device and pulling this pin to low will disable device. The EN pin cannot be left floating. Enable Input. Pulling this pin to high will disable the device and pulling this pin to low will enable device. The ENB pin cannot be left floating. Fault Indication Pin. This pin goes low when a current limit or an over-temperature condition is detected after a 8ms deglitch time. Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or EN is low, the output voltage is discharged by an internal resistor.

4

3

4

5 6 7 8

1

3

5

1

VOUT

Block Diagram

VIN Short-Circuit Protection Current Limit

VOUT

UVLO

Charge Pump

EN/ ENB

Gate Driver and Control Logic

OCB

GND OTP

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APL3510/1

Typical Application Circuit

3.3V

5V CIN VIN VOUT CBYP COUT 150µF APL3510A/B/C/D/E/F 0.1µF APL3511A/B/C/D OCB EN/ENB GND

USB Port VBUS D+ DGND

50k USB Controller

1µF

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APL3510/1

Function Description

VIN Under-Voltage Lockout (UVLO) The APL3510/1 series of power switches have a built-in under-voltage lockout circuit to keep the output shutting off until internal circuitry is operating properly. The UVLO circuit has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. When input voltage exceeds the UVLO threshold, the output voltage starts a soft-start to reduce the inrush current. Power Switch The power switch is an N-channel MOSFET with a low RDS(ON). The internal power MOSFET does not have the body diode. When IC is off, the MOSFET prevents a current flowing from the VOUT back to VIN and VIN to VOUT. Current-Limit Protection The APL3510/1 series of power switches provide the current-limit protection function. During current limit, the devices limit output current at current limit threshold. For reliable operation, the device should not be operated in current limit for extended period. Short-Circuit Protection When the output voltage drops below VIN-1V, which is caused by an over-load or a short-circuit, the devices limit the output current down to a safe level. The short-circuit current limit is used to reduce the power dissipation during short-circuit conditions. If the junction temperature reaches over-temperature threshold, the device will enter the thermal shutdown. OCB Output The APL3510/1 series of power switches provide an open-drain output to indicate that a fault has occurred. When any of current-limit or over-temperature protection occurs for a deglitch time of tD(OCB), the OCB goes low. Since the OCB pin is an open-drain output, connecting a resistor to a pull high voltage is necessary. Enable/Disable Pull the ENB above 2V or EN below 0.8V will disable the device, and pull ENB pin below 0.8V or EN above 2V will enable the device. When the IC is disabled, the supply current is reduced to less than 1µA. The enable input is compatible with both TTL and CMOS logic levels. The EN/ENB pin cannot be left floating. Over-Temperature Protection When the junction temperature exceeds 140oC, the internal thermal sense circuit turns off the power FET and allows the device to cool down. When the device' juncs tion temperature cools by 20 oC, the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed to protect the IC in the event of over temperature conditions. For normal operation, the junction temperature cannot exceed TJ=+125oC.

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APL3510/1

Application Information

Input Capacitor A 1µF ceramic bypass capacitor from VIN to GND, located near the APL3510, is strongly recommended to suppress the ringing during short circuit fault event. Without the bypass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry. Output Capacitor A low-ESR 150µF aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to reduce the voltage droop during hot-attachment of downstream peripheral. (Per USB 2.0, output ports must have a minimum 120µF of low-ESR bulk capacitance per hub). Higher-value output capacitor is better when the output load is heavy. Additionally, bypassing the output with a 0.1µF ceramic capacitor improves the immunity of the device to short-circuit transients. Layout Consideration The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop, droop and EMI. The following guidelines must be considered: 1. Please place the input capacitors near the VIN pin as close as possible. 2. Output decoupling capacitors for load must be placed near the load as close as possible for decoupling highfrequency ripples. 3. Locate APL3510 and output capacitors near the load to reduce parasitic resistance and inductance for excellent load transient performance. 4. The negative pins of the input and output capacitors and the GND pin must be connected to the ground plane of the load. 5. Keep VIN and VOUT traces as wide and short as possible.

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APL3510/1

Package Information

SOP-8

D SEE VIEW A

E1

E

e

b

h X 45

°

c

A2

0.25 GAUGE PLANE SEATING PLANE L VIEW A SOP-8 INCHES MIN. MAX. 0.069 0.004 0.049 0.010 0.012 0.007 0.189 0.228 0.150 0.050 BSC 0.020 0.010 0.197 0.244 0.157 0.010 0.016 0° 0.020 0.050 8° 8°

S Y M B O L A A1 A2 b c D E E1 e h L 0

MILLIMETERS MIN. MAX. 1.75 0.10 1.25 0.31 0.17 4.80 5.80 3.80 1.27 BSC 0.25 0.40 0° 0.50 1.27 0.51 0.25 5.00 6.20 4.00 0.25

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

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A1

A

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APL3510/1

Package Information

MSOP-8

D

SEE VIEW A

E1 e b

E

c

A2

0.25 VIEW A MSOP-8 INCHES MIN. MAX. 0.043 0.000 0.030 0.009 0.003 0.114 0.185 0.114 0.026 BSC 0.80 8° 0.016 0° 0.031 8° 0.006 0.037 0.015 0.009 0.122 0.201 0.122 MAX. 1.10 0.15 0.95 0.38 0.23 3.10 5.10 3.10

A

A1

S Y M B O L A A1 A2 b c D E E1 e L 0

MILLIMETERS MIN.

0.00 0.75 0.22 0.08 2.90 4.70 2.90 0.65 BSC 0.40 0°

Note: 1. Follow JEDEC MO-187 AA. 2. Dimension¡§ D¡¨does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension¡§ E1¡¨does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 5 mil per side.

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0

L

GAUGE PLANE SEATING PLANE

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APL3510/1

Package Information

SOT-23-5

D e

SEE VIEW A E1 b e1 E

c

0.25 GAUGE PLANE SEATING PLANE VIEW A

0

A2 A1

A

L

S Y M B O L A A1 A2 b c D E E1 e e1 L 0

SOT-23-5 MILLIMETERS MIN. MAX. 1.45 0.00 0.90 0.30 0.08 2.70 2.60 1.40 0.95 BSC 1.90 BSC 0.30 0° 0.60 8° 0.012 0° 0.15 1.30 0.50 0.22 3.10 3.00 1.80 0.000 0.035 0.012 0.003 0.106 0.102 0.055 0.037 BSC 0.075 BSC 0.024 8° MIN. INCHES MAX. 0.057 0.006 0.051 0.020 0.009 0.122 0.118 0.071

Note : 1. Follow JEDEC TO-178 AA. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

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APL3510/1

Carrier Tape & Reel Dimensions

OD0 P0 P2 P1 A E1 F K0 B SECTION A-A T B0 A0 OD1 B A SECTION B-B

d

Application

A 330.0¡Ó .00 2

H 50 MIN. P1 8.0¡Ó .10 0 H 50 MIN. P1 8.00¡Ó .10 0 H 50 MIN. P1 4.0¡Ó .10 0

H A

T1

T1 12.4+2.00 -0.00 P2 2.0¡Ó .05 0 T1

C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00 C

d 1.5 MIN. D1 1.5 MIN. d 1.5 MIN. D1 1.5 MIN. d 1.5 MIN. D1 1.0 MIN.

D 20.2 MIN. T 0.6+0.00 -0.40 D 20.2 MIN. T 0.6+0.00 -0.40 D 20.2 MIN. T 0.6+0.00 -0.40

W

W

E1

F 5.5¡Ó .05 0 K0 2.10¡Ó .20 0 F 5.5¡Ó .05 0 K0 1.40¡Ó .20 0 F 3.5¡Ó .05 0 K0 1.50¡Ó .20 0 (mm)

12.0¡Ó .30 1.75¡Ó .10 0 0 A0 6.40¡Ó .20 0 W B0 5.20¡Ó .20 0 E1

SOP-8

P0 4.0¡Ó .10 0

Application

A 330.0¡Ó .00 2

12.4+2.00 13.0+0.50 -0.00 -0.20 P2 2.00¡Ó .05 0 T1 8.4+2.00 -0.00 P2 2.0¡Ó .05 0 D0 1.5+0.10 -0.00 C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00

12.0¡Ó .30 1.75¡Ó .10 0 0 A0 5.30¡Ó .20 0 W 8.0¡Ó .30 0 A0 3.20¡Ó .20 0 B0 3.30¡Ó .20 0 E1 1.75¡Ó .10 0 B0 3.10¡Ó .20 0

MSOP-8

P0 4.00¡Ó .10 0

Application

A 178.0¡Ó .00 2

SOT-23-5

P0 4.0¡Ó .10 0

Copyright © ANPEC Electronics Corp. Rev. A.6 - Dec., 2009

18

www.anpec.com.tw

APL3510/1

Devices Per Unit

Package Type SOP-8 MSOP-8 SOT-23-5 Unit Tape & Reel Tape & Reel Tape & Reel Quantity 2500 3000 3000

Taping Direction Information

SOP-8

USER DIRECTION OF FEED

MSOP-8

USER DIRECTION OF FEED

SOT-23-5

USER DIRECTION OF FEED

Copyright © ANPEC Electronics Corp. Rev. A.6 - Dec., 2009

19

www.anpec.com.tw

APL3510/1

Classification Profile

Classification Reflow Profiles

Profile Feature Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time (tP)** within 5°C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to peak temperature Sn-Pb Eutectic Assembly 100 °C 150 °C 60-120 seconds 3 °C/second max. 183 °C 60-150 seconds See Classification Temp in table 1 20** seconds 6 °C/second max. 6 minutes max. Pb-Free Assembly 150 °C 200 °C 60-120 seconds 3°C/second max. 217 °C 60-150 seconds See Classification Temp in table 2 30** seconds 6 °C/second max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Copyright © ANPEC Electronics Corp. Rev. A.6 - Dec., 2009 20 www.anpec.com.tw

APL3510/1

Classification Reflow Profiles (Cont.)

Table 1. SnPb Eutectic Process ­ Classification Temperatures (Tc) Package Thickness <2.5 mm 2.5 mm Package Thickness <1.6 mm 1.6 mm ­ 2.5 mm 2.5 mm Volume mm <350 260 °C 260 °C 250 °C

3

Volume mm <350 235 °C 220 °C

3

Volume mm 350 220 °C 220 °C Volume mm 350-2000 260 °C 250 °C 245 °C

3

3

Table 2. Pb-free Process ­ Classification Temperatures (Tc) Volume mm >2000 260 °C 245 °C 245 °C

3

Reliability Test Program

Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245°C 1000 Hrs, Bias @ 125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM¡Ù2KV VMM¡Ù200V 10ms, 1tr¡Ù 100mA

Customer Service

Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838

Copyright © ANPEC Electronics Corp. Rev. A.6 - Dec., 2009

21

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Information

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