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SEMICONDUCTOR TIMES

MARCH 2010 / 1

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MARCH 2010 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES VOL 15 ISSUE 3

Radar Scope

Eden Park

Eden Park Illumination (EPI) was founded in May 2007 to develop and commercialize products based on a new platform lighting technology called Microplasma. The co-founders, Professors Gary Eden and Sung-Jin Park, are recognized leaders in this field, with many years of research at the Laboratory for Optical Physics and Engineering at the University of Illinois at Urbana-Champaign. The company has secured $3 million from Illinois Ventures, RPM Ventures and Yellowstone Capital, and "is always looking for additional capital." Eden Park has 13 employees. Conventional macroscale plasma light sources, such as arc lamps, high-intensity discharge (HID) lamps and fluorescent lamps, are energy efficient and cost effective; however, they have several limitations. The electrodes must be far apart for high efficiency. Low pressure, required if the electrodes are far apart, makes the devices fragile. High efficiency requires the

SIA Dec 2009 Global Sales ($B)

25.0

use of toxic mercury. Tubes and bulbs require bulky fixtures. And they often emit heat, or require heating. EPI is focused on commercializing Microcavity Plasma ("microplasma") lighting systems that consist of microscale devices that emit light using a plasma discharge, and involves creating microplasmas in large arrays. Microplasma ultra thin lighting technology can be flexible, formed and produces white or colored light. EPI holds a prominent global patent portfolio centered around its microcavity plasma IP. Microplasma lamps are mercury-free, environmentally responsible flat panel microcavity discharge devices. The technology originates from traditional plasma lighting technology, but microplasma, by virtue of its unique structure, overcomes the limitations of conventional macro-scale plasmas and offers a flat, ultrathin, lightweight, flexible, robust, high-energy efficiency and long-lasting alternative.

SEMI's N. American Equipment Bk/Bl

1200 1.4 1.2 1000

Microcavity plasma technology combines a new electrode design and configuration. The electrodes are close

together and allow Mercury-free gas mixtures to be used while still achieving high efficiency. Close electrode spacing permits operation at near atmospheric pressure, which allows for new thin and flat form factors. Flat panel technology allows for high efficacy slim luminaires without the need of an external reflector to direct the light. Microplasma is flat, thin and includes optics, resulting in the highest utilization factor of any existing commercial

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IN THIS ISSUE

Radar Scope .................................... 1 Cliff Rants ....................................... 2 Startup Profiles .............................. 5 People ........................................... 13 Funding & IPOs ............................. 14 Mergers & Acquisitions ............... 15 Business & Financials ................... 16 Market Research .......................... 17 Emerging Trends .......................... 17 New Products ............................... 17 Licensing & Partnerships ............. 21 Design Wins ................................. 21 Company Financials ..................... 22 Stock Charts ................................. 23

20.0

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15.0

Dollars (Millions) 600 0.6 Bk/Bl Ratio 0.8

10.0

400 0.4

5.0

200 0.2

0.0 12/08 1/09 2/09 3/09 4/09 5/09 6/09 7/09 8/09 9/09 10/09 11/09 12/09

0 Jan-09 Feb-09 Mar-09 Apr-09 May-09 Jun-09 Jul-09 Aug-09 Sep-09 Oct-09 Nov-09 Dec-09 (final) Jan-10 (prelim.)

0

Am erica

Europe

Japan

Asia Pacific

Bookings

Billings

Book-to-Bill

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2 / MARCH 2010

SEMICONDUCTOR TIMES

Cliff Rants

Just when you think you've seen it all, right? Funding events are abysmal and we would all agree that the past year has been nothing less than brutal for semiconductor startups. But surprisingly, the level of innovation demonstrated by this month's startups is astounding. Microplasma lighting, adaptive analog beamforming, PUF IP, solid-state optical lens, 3G CMOS PAs finally, normally-off JETs and more. Who would have thunk it? These are really amazing technologies ­ all delivered by emerging startups. If I'm to draw conclusions, two things are apparent. First, these companies are all developing really hard stuff. We're not talking integration plays ­ this is science. Second, these companies are predominantly at the fringe of what we would call a traditional fabless semiconductor company. I think semiconductor-centric would be a better term. They say opportunity lies at the edges. Well I'd say these companies are all operating at fringe. They hardly fit the "yet another processor" category. CEITEC S.A. ­ Brazilian Semiconductor Company CEITEC is the result of Brazil's semiconductor aspirations. Does Brazil need a semiconductor industry? Based upon an analysis of GDP composition, Brazil believes a domestic electronics industry is imperative. And that starts with semiconductors. Government backing and import duties give CEITEC a head start. From there, only time will tell it Brazil can develop a worldclass competitive semiconductor sector. Eden Park Illumination ­ Microplasma Lighting Systems Eden Park's ultra thin microplasma lighting technology has endless applications. Architectural lighting is an obvious initial market and I can envision myriad other market opportunities as the technology matures. The possibility of large-scale reel-to-reel manufacturing is enticing as well. If this technology delivers as promised, I think Eden Park is a home run. Linear Signal ­ Adaptive Analog Beamforming Antennas Linear Signal is remarkable for several reasons. First, it is incredibly capital efficient, have products two chips and key beamforming antenna technology on a scant $1.8 million raised to date. The company only has one employee ­ the ultimate in virtualization. By harnessing dispersed best-in-class microwave design, beamforming algorithm and antenna systems engineering resources, the company has amassed the wherewithal to deliver game-changing smart antenna systems. Intrinsic-ID ­ Physically Unclonable Functions (PUF) IP Hardware Intrinsic Security (HIS) solutions based on physically unclonable functions are emerging as a key technology because counterfeiting is becoming an increasingly challenging

problem for everything from designer brands to military electronics. Intrinsic-ID argues that it is the only company to offer technology-independent key storage without storing the key for semiconductor companies. The company declined to elaborate; however, competitor Verayo was more than happy to say that its technology hails from MIT and is available as soft IP for FPGAs. That sounds technology independent to me ­ right? LensVector ­ Solid-State Optical Lens for Mobile Electronics A solid-state optical lens that can shape, steer and focus light without mechanical movement. Yeah, I squinted my eyes too when I heard that. But LensVector does just that using liquid crystal technology. The technology is remarkable and another game changer, eliminating myriad problems, ranging from size, to ruggedness and power poised by mechanical lens. The fact that it is receiving tremendous response from handset customers should come as no surprise. Javelin Semiconductor ­ 3G CMOS PAs for Handsets Finally... I have been hearing about 3G CMOS PAs for handsets for so long. They have been hailed as the Holy Grail, yet it was beginning to look like all promise with no substance. Well Javelin has dashed that notion by introducing an all-CMOS 3G PA with not just equal, but superior performance versus its GaAs counterparts. Suvolta ­ JFET Technology I am only guessing at Suvolta's game plan. However, if it is indeed centered around normally-off complementary Junction Field Effect Transistors (JFET), the technology is poised to displace the traditional polysilicon gate MOSFET, providing superior low power performance. Sapphicon ­ Silicon-on-Saphire (SoS) Foundry & Services Sapphicon is the former semiconductor fabrication facility of Peregrine Semiconductor Australia. The company argues that SoS is lower cost than GaAs and SiGe and able to achieve high levels of integration. Mask tooling is much lower cost on SoS because it is a simpler process. The insulating Sapphire substrate enables superior performance and even optical applications as it is transparent. Based on the licensing terms from Peregrine, it would appear that Sapphicon has myriad avenues for capitalizing on the benefits of SoS technology. Scintera ­ Adaptive RF Power Amplifier Linearizer SoC Scintera was formed during the telecom bubble and watched its market opportunity evaporate during the telecom meltdown. However, the company survived, an enviable feat in and of itself, and applied its core analog signal processing platform to address the RF power amplifier linearizer market opportunity. This time, the company appears to have caught the leading edge of the 4G wave. It has been delivering silicon since August 2009, has very high margins, and has the opportunity to address a wide range of emerging base station needs.

Copyright 2010, Pinestream Communications, Inc. 52 Pine Street, Weston, Massachusetts 02493 USA Tel 781.647.8800 Fax 781.647.8825 www.pinestream.com [email protected]

SEMICONDUCTOR TIMES

MARCH 2010 / 3

Radar Scope

(Continued from page 1)

lighting technology. The low heat and generous light output of the device are well suited to illuminate merchandizing, architectural surfaces and tasklighting. The company's manufacturing process is proven and borrows equipment and many process steps from the plasma TV industry, although it is far simpler, on the order of 8-9 process steps versus 50 for a plasma TV. The luminary panels are currently fabricated on an aluminum substrate with a glass top and are only a few millimeters thick. Panels have been fabricated on plastic and a reel-to-reel manufacturing process is certainly possible in the future. The company is currently focused on the architectural lighting market for applications such as under-cabinet and under-shelf lighting. The initial panels will measure 6 inches square and will produce white light. Demo samples are due imminently and general sampling is anticipated later this year. The company will pursue product manufacturing as well as technology licensing. Bill Thalheimer, CEO (currently Chairman of Northern Elastomeric; previously CEO and President of Imaging Automation and CoChairman and COO of VST Technologies) Ron van Os, COO (previously EVP and COO of Imaging Automation and SVP and Chief Product officer at L-1 Identity Solutions) Philip Warner, President (previously held senior National and International management positions at Philips Lighting) Thane Hanson, CFO

Dr. Sung-Jin Park, Co-Founder and VP of Science (Adjunct Associate Professor in the Department of Electrical and Computer Engineering at the University of Illinois, where he has devoted nine years of research on the microplasma phenomenon and device materials) Jeffry Bulson, Director of Plasma Development (previously with the Panasonic Plasma Display Laboratory in New York) Clara Powell, VP Marketing 903 N Country Fair Drive Champaign, IL 61821 Tel: 217.403.1866, Fax: 217.403.1867 www.edenpark.com www.epillum.com

counter-electrode, leading to long battery life. FlexEl's battery is rechargeable at onethird the voltage necessary to recharge lithium cells, with a higher nominal capacity per unit area. The low recharging voltage enables RF recharging with low incident power and potentially other low voltage sources, such as solar and mechanical. The FlexEl battery is especially wellsuited to power ultra small electronics, including wireless sensor networks, backup power for mission critical applications, implantable medical devices, RFID devices, and smart cards. The FlexEl process is also well suited to hybrid capacitor/battery systems for use in devices that require a high burst power supply. The company will be formerly launched later this year. Dr. Bob Proctor, CEO, M: 703.627.2077 Dr. Martin Peckerar, Founder Dr. Neil Goldsman, Founder 387 Technology Drive College Park, MD 20742 Tel: 301.314.1004 www.flexelinc.com

FlexEl

FlexEl was founded in 2008 to develop a rechargeable, flexible thin film battery. The company has received support from the Maryland Technology Development Corporation. Flexel has developed three unique technologies:

· proprietary battery chemistry,

for higher capacity and lower voltage recharging

· a cost-effective printable manufacturing process

Linear Signal

Linear Signal was founded in late 2007 to develop smart antenna systems. The company has raised roughly $1.8 million to date from angel groups and VCs. Linear Signal is unique in that it has only one full time employee, the founder and CEO, with another 32 people working for the company in some capacity. To date, the company has relied upon partnerships, university development, and other outsourcing techniques to keep development costs extremely low.

· integrated power management

that preserve the advantages inherent in thin-film batteries while dramatically improving upon the current state-of-the-art The unique chemistry enables extremely high capacity and the ability to be printed as a thin film to most surfaces. The large surface area of the "nano-particulate" base material and the low pH electrolyte ensures that there will be little dissolution of the

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4 / MARCH 2010

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Radar Scope

(Continued from page 3)

Linear Signal was founded by IPTV folks looking for a better way to ingest television signals into edge networks, particularly multi-dwelling unit infrastructure such as apartment buildings, hospitals, hotels, etc. The current "farm" of 10+ large C-band antennas is cost prohibitive for this application. To solve this problem Linear Signal has developed a single smart satellite antenna that would replace multiple traditional reflector antennas. Today's smart antenna technology is grossly expensive, making smart antennas for satcom virtually non-existent in commercial and consumer markets. On the other end of the cost spectrum, a typical satellite television reflector antenna, the type used by Dish and DirecTV subscribers, will cost $75 to $460. A smart antenna for this application, built from current off-the-shelf parts, would cost $100,000 to $300,000. This same smart antenna produced with Linear Signal parts would cost $250 to $750. This is the lowest end of the market. Depending on the application, reflector antenna solutions can cost over $100,000, particularly for satcom on the move and in aviation and marine applications. These more expensive reflector antenna solutions will be Linear Signal's initial market focus. By leveraging advanced applicationspecific microwave component designs, Linear Signal drops antenna element counts by 50% to 96%. The company integrates all of the electronics needed for up to 8 of these smaller antenna elements into highly integrated low-cost SiGe BiCMOS chips fabricated by Jazz, reducing

component count by 12 to 20X. Using proprietary analog system technology, the company can work with heavy bandwidths without the huge processor costs of digital solutions. Linear Signal has pursed beamforming R&D to reduce core beamforming cost drivers: phase shifters, DSP, and numbers of antenna elements. The synergy that occurs when combining these cost saving measures across disparate disciplines makes Linear Signal's smart antennas solutions 200 to 600X less expensive than today's solutions, making them only feasible in commercial satellite markets for the first time, and even in lower cost consumer applications. In addition to better data rates, frequency use, and power consumption, Smart satellite antennas are self-aiming, can see the whole sky, can switch satellites instantaneously, can track fixed and moving satellites, can block sources of interference, even when the sources of interference are moving, can operate from moving platforms, and more. The company's patent-pending Ad-ABeamTM family of chips performs Adaptive Analog Beamforming for wideband wireless beam steering and beam shaping applications. The devices perform phase shift and amplitude control and offer adaptive beam steering/shaping at up to 20x savings by replacing expensive DSPs or traditional phase shifting components. Using adaptive beamforming (moving beams), not only can wireless connections be maintained while the transmitter or receiver is moving, but the smaller secondary beams, called sidelobes, can morph and reshape to avoid changing sources of potential interference.

The Ad-A-Beam family of chips offer frequency flexibility from 1-12 Ghz and enables beamforming-enhanced wideband wireless transmission and reception for myriad products. Ad-A-Beam is particularly valuable in heavy data streams such as television, radio, and broadband and in applications leveraging numerous antenna elements. The company has developed its first two analog beamforming chips (receive and transmit) targeting Ku band Satcom applications (12-18GHz), such as satellite television or Internet, but can be used in some X band radar applications. These beamforming chips have an immediate market opportunity in military/radar applications. Early revenues from chip sales will support the development and growth of the company's antenna systems business. Because of its virtual company development strategy, the total costs for developing these two chips is roughly 1/5 of the industry norm. The chips are designs at Washington State University. Microwave and antenna system development will initially rely on a similar low cost relationship with Brigham Young University, where the company is building the Linear Signal Center for Smart Antenna Systems. The company will soon launch two more chipsets: a Ka band beamforming chipset for Satellite Television and Internet, and a wide frequency band chip covering the L, S, C, and X bands. This chip will also provide access to various terrestrial wireless beamforming markets. The annual global antenna systems market represents a $1.5 million opportunity comprised of radar ($530M), Satcom ($600M), and wireless ($300M). Further, low cost smart

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SEMICONDUCTOR TIMES

MARCH 2010 / 5

antennas for satellite will likely open new markets of equal or larger size. There are also non-satellite opportunities that may be even larger. To capture the most value and offer the lowest cost solutions, the company plans to sell complete smart antenna solutions, not just chips. The company will rely on customer's marketing engines and market share, and channel resellers. Linear Signal's competitive sweet spot is heavy bandwidth across many antenna elements. Linear Signal argues that there are no other entities selling beamformer chips and optimized microwave antennas for low cost smart antennas in satcom. Partial replacements exist at the discrete chip level, but they are inferior in performance and/or vastly more expensive to integrate. Potential substitutes exist at the parts level by using bulky, heavy and expensive passive and discrete components that are even more expensive than the partial replacements. Reflector antennas are a substitute at the system level, but from a performance standpoint, Linear Signal argues that are no head-tohead advantages for reflector-based antennas. The company believes that its focus on low cost smart satellite antennas is unique and combines a very diverse set of technical capabilities, ranging from microwave components design to beamforming algorithm development and antenna systems engineering. Linear Signal believes it possesses the best low noise process technology, allowing arrays to be smaller than other arrays. The company is pursuing numerous applied for patents and has secured certain licensing advantages or exclusivity. Linear Signal is currently in discussions with numerous companies that

could benefit from its smart antenna technology. The company is about a year away from delivering complete smart antenna solutions. Gregory Mockett, Founder & President (previously founded Orangatango, acquired by iEntertainment, and ICentral, acquired by Open Market) Dr. Karl Warnick, Founder & Chief Scientist (professor in the Department of Electrical and Computer Engineering at Brigham Young University) 86 North University Ave., Suite 400 Provo, Utah 84601 Tel: 801.337.9100 www.linearsignal.com [email protected]

switched off by applying a bias voltage to the gate. Obviously, a normally-on device is not very useful for today's SoCs. We believe Suvolta is developing complementary JFET technology operating in the enhancement mode (normally-off). Suvolta believes this technology is well suited for DSM circuits below 65 nm. Compared to traditional polysilicon gate MOSFETs, Suvolta argues that its JET technology provide significant reductions in power dissipation, gate capacitance, gate leakage current, and source drain leakage current. The JFET is simpler to manufacture as well. Bruce McWillians, Ph.D., CEO (previously Chairman, President and CEO of Tessera) Ashok Kapoor, Ph.D., co-founder & CTO (previously a director of device technology at National and LSI, and founder of SemiSolutions) Jim Koford, VP of Engineering (previously Chairmans and CEO of Monterey Design Systems, and CTO and VP, Engineering at LSI) 130 D Knowles Dr. Los Gatos, CA 95032 Tel: 408.866.4125 www.dsmsolutionsinc.com

Suvolta

Suvolta was founded in 2005 as DSM Solutions to develop low power CMOS semiconductor technology. In Q4'09, the company raised $3 million from August Capital and Kleiner Perkins Caufield & Byers. According to public sources, the company had raised roughly $26 million to date. The traditional MOSFET is a normally off device that has served the industry well for year. However, as process dimension shrink below 65nm, challenges related to gate dielectric thickness, gate capacitance, gate leakage current, power dissipation and more are becoming more pronounced. Suvolta has a number of patent filings centered around Junction Field Effect Transistor (JFET) technology. A JFET is a simple field effect transistor that lacks dielectric material between the gate and the source/drain channel. The normally-on device is

Startup Profiles

CEITEC S.A.

CEITEC was established in 2008 "to create state-of-the-art semiconductor products for high-volume markets that will be consumed in Latin America as well as exported to global markets." The company's vision is to accelerate the growth of Latin America's electronics industry by leveraging Brazil's regional influence, leadership and economic strength.

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Startup Profiles

(Continued from page 5)

Headquartered in Porto Alegre, Brazil, CEITEC is the only Latin American semiconductor company. Brazil is the largest BRIC country, fifth largest landmass, and fifth largest population in the world. Brazil is focused on providing leadership for South American markets and believes semiconductors are key for the development of an electronics industry. The electronics industry is the largest industrial segment of developed countries, composing more than 12% of GDP in 2010 (source: MITI). It is only surpassed by the services industry and already eclipses raw materials, food, textiles, and transport industries. In 2008, semiconductor imports were US $4B with an additional US $6B on semiconductor content embedded in electronic imports. This is up from US $1.6B in 2001. CEITEC is part of a Brazilian-government-sponsored effort to develop a domestic microelectronics industry. CEITEC has the highest level political support (Federal, State & Local) and has received strategic investment from Brazil's Federal Government totaling > R$400M (US$227M) by the end of 2009. CEITEC is an independent Brazilian corporation with one shareholder ­ the government. The company will receive continued investment and support targeted at growing the Brazilian electronics industry. The company will receive strong tax incentives and has the advantage of avoiding the 30-60% import duties that may be imposed on competing products. CEITEC is implementing a fab-lite strategy with the ability to manufacture analog/digital chips at its facility

in Porto Alegre. The in-house design center with 100+ engineers has the capability to create products up to 55nm. The production center in Porto Alegre is the nucleus for further investment and growth in the Latin America semiconductor industry. The electronics industry in Brazil is too small to fill CEITEC's fab and design capability. Thus the company will focus on high value products and IP serving international and South American markets. The Design Center will engage in product development with selected partners to accelerate product development and amass local know-how. In July 2009, CEITEC opened Latin America's first IC design center, according to the company. The Design Center employees 120+ engineers and offers great opportunities for experienced Brazilian and foreign engineering managers and designers. The Design Center develops ICs with design capabilities from 0.6u to 55nm, and focuses on developing semiconductors that perform a strategic role for Brazil's microelectronics industry. The adjoining six-inch foundry, now in the final stage of setup and certification, is the first and only facility of its kind in Latin America to produce semiconductors. The Fab is currently manufacturing RF analog/digital products for multiple companies and is targeted at high volume and high value-add products in the RF and Analog/Digital domains. In December 2007, CEITEC licensed X-FAB's 0.6u CMOS process technology. In return, X-FAB gains access to the Latin American electronics market. Small volume manufacturing and prototyping will take place at CEITEC's fab and larger volumes will be manufactured by X-FAB in its

facilities in Erfurt, Germany and Lubbock, Texas. CEITEC's 0.6u process will be fully compatible with X-FAB's XC06 analog/mixed-signal process, which features high-voltage transistors and integrated non-volatile memories to address markets such as automotive, industrial and power management. CEITEC is focused in the development and production of ASSPs for RFID, Wireless Communications and Digital Multimedia market segments. The company has expertise in complete mixed-signal solutions (radio+baseband) and multimedia standards (ISDB, DVB, DRM, DAB, etc.) and has already developed components and products for Digital TV to be released in 2010. Obviously, the DSM, high transistor count digital ICs will be manufactured in typical large Asian foundries, not CEITEC's 0.6u foundry. For digital multimedia, the company will focus on ISDB-T International, a digital television broadcast standard spearheaded by Japan and Brazil and used in Latin America. CEITEC recently introduced RFID chips that are the first ever to be entirely designed in Brazil. The devices feature ultra low power consumption, long range (3-7m in UHF, 0.3m in LF), and high read sensitivity. The company plans to produce the chip at its Porto Alegre FAB. The initial use of the RFID devices is for cattle identification in Brazil's agribusiness market, and efforts are under way to expand the technology into all areas of livestock tracking and to other industries that require tracking. The state of Minas Gerais has launched the first field trials of the Chip de BoiTM RFID device. The RFID devices were applied to 500 cows on the Santa Rita Experimental Farm, a unit of the Agricultural

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SEMICONDUCTOR TIMES

MARCH 2010 / 7

Research Corporation of Minas Gerais, and the first to receive the RFID tags. In all, CEITEC will test 10,000 RFIDs products on other farms in various regions of Brazil. Prior to the advent of the Chip de BoiTM, ranchers had two options for traceability: an optical earring with numbers, or bar codes. Optical earrings require manual dictation of the number, and the process has a high potential for error. The product enables electronic tracking and collection of data on the herd. The chip monitors cattle from birth through slaughter, including vaccinations and health records. Due to the high degree of reliability, meat traced electronically with the De Boi chip has a higher value in the market and is better able to meet strict health regulations such as those in the European Union. Eduard Weichselbaumer, Chairman & CEO (Most recently CEO of SOISIC, which was acquired by ARM. Previously CEO of Pacific Silicon Technologies, a semiconductor IP company, VP of Worldwide Sales and Divisional Officer at Artisan Components, and VP Business Development at Virage Logic.) Fábio Pintchovski, Diretor de Manufatura e Pesquisa (previously held several positions at Motorola, ranging from Engineer Mgr. to Tech. VP, and a Technology VP at KLATencor) Estrada João de Oliveira Remião, 777 Porto Alegre - RS 91550-000 Brasil Tel: +55 51 3220-9700 Fax: +55 51 3220-9701 www.ceitec-sa.com

Intrinsic-ID

Intrinsic-ID was founded in 2008 as a spin-out of Royal Philips Electronics "to make counterfeiting a thing of the past" by offering semiconductor IP and services. Intrinsic-ID is a security company dedicated to protecting electronic devices against tampering and counterfeiting. The underlying technology research began inside Philips in 2002. Shares in Intrinsic-ID are held by Prime Technology Ventures, Royal Philips Electronics and employees. Hardware Intrinsic Security (HIS) solutions extract the secret key from the hardware instead of storing it. This approach allows a device to generate a secret key only when needed and power down with no key present. HIS achieves unparalleled security levels because the secret key is not present when the device is switched off. HIS systems are based on physically unclonable functions, or PUFs. A PUF is a physical structure on a device that is very hard to clone due to inherent, device-unique, deep-submicron manufacturing process variations. Using PUFs, HIS systems generate the key only when needed, with no key stored. Two classes of PUFs can be used in HIS systems: those based on specific circuitry and those based on standard, available components. PUFs based on specific circuitry work well in carefully controlled experimental environments, but face significant challenges that limit their commercial viability. These PUFs require costly and timeconsuming test silicon and can be incompatible with commercial tool-flows. PUFs based on standard, available components, on the other hand, do not require test silicon and are easily integrated into standard

ASIC flows, making them far more suitable for commercial applications. Intrinsic-ID claims to offer the only technology-independent key storage without storing the key for semiconductor companies. Intrinsic-ID PUFs are memory-based, and have been confirmed to behave in a predictable manner under all relevant stress conditions, including aging, and temperature and voltage variations. The company's technology makes electronic devices physically unclonable, to a level that even the manufacturer cannot make duplicates. Its security solutions are based on tamper-evident key-storage that once integrated in the customers' IP allows for full control over the deployment of their IP. Intrinsic-ID Quiddikey is claimed to be the only production-proven HIS solution and is based on patented PUF technology that has been deployed in Philips' production environment. Quiddikey is available as RTL source code and can be integrated by customers into their IP blocks to allow for metering, to control outsourced manufacturing and to protect fielded devices from counterfeiting. As an addition to Quiddikey, Intrinsic-ID provides 100% reporting services to protect against manufacturing overproduction. Intrinsic-ID reporting services provide flexible solutions that can be can be deployed securely over the Internet or via a tamper-proof product activation tool at the production line. Application domains include smartcards, automotive and industrial. Quiddikey is currently shipping to customers. Intrinsic-ID solutions have been implemented in production silicon and proven to perform under commercial conditions.

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Startup Profiles

(Continued from page 7)

NXP and Intrinsic-ID recently formed a collaborative agreement to license and deploy a HIS solution in NXP's next-generation SmartMX security chip technology. The partnership enables NXP to utilize Intrinsic-ID's Quiddikey solution to secure SmartMX-powered assets against cloning, tampering, theft-of-service and reverse engineering. NXP SmartMX products incorporating Quiddikey are targeted to enter the market in 2011. Daniël Schobben, Ph.D., CEO, founder (most recently Business Unit Manager for the Philips group that was spun out to form Intrinsic-ID) Pim Tuyls, CTO, founder (as a principal scientist initiated work on PUFs within Philips Research in 2002; a visiting professor at the COSIC institute of the Katholieke Universiteit Leuven) John Elliott, VP Sales (previously held senior mgmt, positions with Aspex Semi and VP/Head European Operations at Simplex Solutions) Tim Smith, VP of Sales, North America (previously VP of WW field operations at Silistix and CoWare, and VP of worldwide sales at Sonics) High Tech Campus 9 5656 AE Eindhoven The Netherlands Tel: +31 40 851 90 20 www.Intrinsic-ID.com 2033 Gateway Place, Suite 500 San Jose, CA 95110 Tel: 408.573.6186

that replace moving parts of tiny cameras found in mobile phones, laptops and other consumer electronics with solid-state optical components. LensVector's vision is to replace all mechanical aspects of cameras with solid-state alternatives. LensVector recently closed $30 million in Series C growth financing, bringing the total financial backing to more than $50 million. Institutional Venture Partners led the round, joining existing investors Menlo Ventures, Samsung, Silicon Valley Bank, Mitsui and Kodak. Headquarters and operations are in Mountain View, California, where the company has a 30,000 square-feet manufacturing facility. In 2009, more than a billion camera modules shipped worldwide in mobile phones, notebook computers and other consumer electronics devices. By 2012, analysts expect camera module shipments to exceed 2 billion units. As image resolution increases to 3-, 5- and even 8-megapixels, the need to focus these camera modules becomes paramount. LensVector has developed optical technology that can shape, steer and focus light without mechanical movement. LensVector replaces the complex, bulky and often fragile mechanical systems of a camera module with simple, solid-state components that are smaller, more reliable and easier to integrate than current offerings. The technology allows miniature camera manufacturers to add optical features, like autofocus, automacro and video focus, without significantly increasing the size, weight or cost of the camera. The patented technology transforms a simple liquid crystal cell into a variable focus lens. LensVector

AutoFocus (LVAF) applies a small control voltage to dynamically change the refractive index of the material the light passes through. LensVector carefully controls the rotation of the molecules in the LC cell to achieve this change in refractive index. LVAF provides a change of focus from infinity to 10 centimeters with good optical performance. LensVector employs proven, highlyscalable production techniques from the LCD and semiconductor packaging industries that are widely used in mobile phone and consumer electronics manufacturing. The company manufactures its autofocus components in large arrays, similar to semiconductor wafers. LensVector has a broad patent portfolio, and its management team brings extensive experience from leading semiconductor, imaging, camera module and LCD companies. Based on this technology, LensVector delivers the smallest autofocus products in the industry. LensVector AutoFocus (LVAF) measures 4.5 x 4.5 x 0.5 mm and weighs 22 mg, enabling autofocus in camera modules as small as 4.5 x 4.5 mm. The smallest mechanical autofocus modules currently available are 8.5 x 8.5 mm. LensVector AutoFocus is easy to integrate, is more rugged and reliable than mechanical alternatives, consumes half the power of mechanical devices, and provides silent, smooth focus for video. LensVector AutoFocus is sampling today with key customers and "is receiving tremendous response from handset customers." The technology could be in products as soon as the 2010 holiday season. Derek Proudian, CEO (previously CEO of five venture-capital backed startups, including Zip2, which was acquired by Compaq for $300

LensVector

LensVector was founded in 2006 to develop solid-state optics solutions

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million, and a general partner at Mohr Davidow Ventures) Dr. Tigran Galstian, CTO (a professor at Laval University in the Center for Optics, Photonics and Lasers in Quebec, where he and his research team developed the LensVector tunable liquid crystal lens technology) Dr. Bahram Afshari, VP Engineering (previously responsible for camera module product development at Flextronics) Suresh Venkatraman, VP Marketing (previously held senior marketing and product management roles within the Imaging Group at Micron) Henning Stauss, VP Operations (previously VP of global manufacturing for Syntax-Brillian and ran worldwide LCD operations at Three-Five Systems) Peter Clark, VP Optics (previously director of optical engineering at Flextronics) Thomas Killick, VP Business Development (previously director of business development at Precision Optical Systems) 2307 Leghorn Street Mountain View, CA 94043 Tel: 650.618.0700 www.lensvector.com

secured $6.3 million in Series A funding from Sevin Rosen Funds and Silverton Partners, and is currently closing an up-round from insiders. The company has 17 employees and is growing. Javelin recently introduced the JAV5001 3G power amplifier (PA), which claims to provide the industry's best performance in a robust, reliable, standards-compliant product. By achieving compliance to the stringent, industry-standard 3GPP specifications for W-CDMA and HSPA, the JAV5001 represents a breakthrough that is expected to initiate the longanticipated shift in wireless PAs from GaAs to CMOS. The device is the world's first monolithic CMOS 3G PA and has the lowest battery current, best PA noise, highest reliability, and fewest BOM components while being 3GPP compliant in an industry-standard 3x3 mm pin-out compatible package. Javelin's PA architecture and design includes complementary gain stages, stabilization circuits and compensation algorithms that cannot be replicated in SiGe or GaAs processes. CMOS provides the highest quality, access to huge capacity at the lowest cost, and a roadmap to the highest integration. Javelin achieved first-pass success, avoiding the numerous experiments and design revisions that PA development efforts have historically required. The company has had a relentless focus on modeling and simulation. The first design fully meets 3GPP specs., supporting a rapid transition to mass production. Javelin's products are sourced from the world's largest foundries, opening up virtually unlimited worldwide capacity to the PA market, which historically has been subjected to allocation during peak demand cycles.

Javelin has innovations in architecture, circuit implementation and modeling. Based on a patented architecture (15 patents) implemented in standard CMOS, the JAV5001 minimizes power consumption across output power levels, resulting in the industry's lowest battery current in real-world, 3G cell phone operating conditions. The JAV5001 improves battery life, robustness and reliability while simplifying the design-in process for 3G mobile phones and datacards. The JAV5001 is a 3G UMTS band I PA that requires only two external components and features a single connection to the battery, resulting in the industry's lowest bill-of-materials and enabling rapid adoption by cell phone manufacturers. The device integrates input and output matching circuits, PA bias regulators, and PA control. The JAV5001 is stable across output loads including protection for open and short circuits, difficult to damage in harsh environments and has the lowest out-of-band noise of any cellular PA on the market today. The JAV5001 integrates complete circuitry for power regulation, PA bias, input and output matching and power control into an industry-standard 3x3 mm package. In the dominant lowpower and medium power modes, the device features lower power consumption than any competitor. The mobile handset PA opportunity is large and growing. A typical phone may support four GSM/EDGE bands (850, 900, 1800, 1900) and up to five WCDMA bands. Next-gen LTE adds an additional three frequency bands. As an example, the Samsung Rugby A837, released in Sept-08, includes two Avago WCDMA PAs and a RFMD GSM/EDGE PA. The total 3G PA TAM in 2010 is $540 million

Javelin Semi

Javelin Semiconductor was founded in August 2007 to develop "high performance, mixed-signal ICs for the wireless communications market." Javelin is focused on developing advanced CMOS PAs for 3G/4G applications. The founders hail from Silicon Labs' Aero product line, which was sold to NXP, and collectively hold over 100 patents in CMOS RF and power circuits. The company has

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positions at NetBotz, and also worked for Crystal Semiconductor) 4635 Boston Lane, Suite 200 Austin, TX 78735 Tel: 512.684.6350 Fax: 512.684.6351 www.javelinsemi.com

have fewer non-linearities at high frequencies than those manufactured with standard CMOS processes. Silicon-on-Sapphire allows designs with lower power, wider frequency range, higher frequency, lower jitter and lower noise specs compared to traditional bulk CMOS processes. SoS features excellent RF performance, very high linearity transistors, high Q integrated inductors, resistors and capacitors, high isolation, integrated EEPROM without additional process steps, multiple threshold options without additional cost, extremely low-loss substrate at RF frequencies, and excellent ESD protection with low parasitics. Lower capacitance enables higher speed at lower power. Fully depleted operation improves linearity, speed, and low voltage performance. SoS provides new design options over GaAs due to availability of good PMOS transistors. The optically transparent substrate enables use in optical applications. SoS can be processed in standard CMOS facilities on large wafers. SoS is also a much simpler process than bulk CMOS and other more exotic process. Compared to GaAs, SoS is lower cost and is able to integrate logic, memory and passives on-chip. Compared to SiGe, it is lower cost and is able to integrate high quality passives onchip. Mask tooling is much lower cost on SoS because it is a simpler process. Sapphicon offers a range of processes based on SoS technology, available either on a foundry basis or Compressed Reticle service. The company offers 0.5u or 0.25u SoS foundry services using 150mm (6 inch) wafers with up to 3 metal and 1 poly layers. The maximum field size is roughly 3234 mm2, yielding approx. 450 fields

(450M handsets x 2 bands x $0.60 per band). Competitors include Anadigics, Avago, RFMD, Skyworks, and Triquint. Javelin provides the lowest average PA current, lowest PA noise, lowest total BOM cost reducing up to 15 external passives to 2, and best reliability (best ESD performance, best protection for the battery, RFOUTPUT protection to open and short circuits, and rugged logic pins). The JAV5001 is fabricated in standard CMOS on a very mature and high yielding process node. Samples are available now, with volume production to begin in June 2010. The device is with customers now. Future plans will extend Javelin's technology into a full family of CMOS 3G PAs. Brad Fluke, President and CEO (previously held senior management positions at Silicon Labs, including VP of Marketing, GM of the Wireline & Networking business units, and VP of Business Development) Patrick Morgan, Ph. D., VP of Marketing (previously Director of Product Marketing at Alereon and Marketing Manager at Silicon Labs responsible for the Aero transceiver product line) David Bockelman, Ph.D., VP of Engineering (previously held project leadership and senior engineering positions in cellular PAs and transceivers at Silicon Labs) Abhay Misra, VP of Operations (previously VP of Engineering and Ops. at Cubic Wafer and Dir. of Manf. Tech. for Silicon Labs) Lori Lowe, CFO (previously CFO at Nuventix, held management

Sapphicon

In July 2008, Sapphicon was formed when a private investor acquired the semiconductor fabrication facility of Peregrine Semiconductor Australia. For seven years prior, the facility manufactured ICs for Peregrine using Silicon-on-Saphire (SoS) process technology. As part of the acquisition, Peregrine continued to source manufacturing services from Sapphicon. No additional capital is needed. The company has 80 employees and expects to double that within 2 years. Sapphicon has now transitioned from being a captive fab that manufactures ICs solely for Peregrine, to a product and technology development and manufacturing company. Sapphicon licensed the SoS process from Peregrine and offers low cost IC prototyping services, custom chip design capability and foundry services. The company is still processing wafers for Peregrine. Silicon-on-Sapphire (SoS) process technology is used to create CMOS ICs in a thin layer of silicon on an insulating substrate of Sapphire. SoS is an ideal process for high-frequency RF and mixed-signal devices as its insulating substrate eliminates parasitic capacitances from the circuit, which allows higher frequencies, low power consumption, and high Q passives to be achieved. Transistors created using SoS technology also have much lower junction capacitance and thus

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per wafer. The company is also working on a number of new technologies. In early 2009, Sapphicon introduced a low cost prototyping service called Compressed Reticle. Multi-Project Wafers have a number of drawbacks such as the need to share the wafer with other users, limited die area, and fixed dates for runs. Sapphicon argues that the Compressed Reticle service overcomes these issues and provides greater flexibility for the user. Tooling is dedicated to each customer's design and a complete wafer is supplied. In many cases, there are enough devices on the wafer to fulfill small production runs. For example, an initial production run may yield 500 - 2,000 chips depending on chip size. There are also no fixed dates for runs. The low cost prototyping service is available for $25k to $40K for mask tooling and a wafer depending on process and application. Process Design Kits (PDKs) for AWR and Cadence are available that include P-cells, models, LVS and DRC. Sapphicon and AWR recently introduced PDKs for AWR software that support Sapphicon's SoS processes. AWR's Analog Office RFIC design software is used to develop Sapphicon PDKs because of its ability to provide extremely accurate models. SoS technology can be used to create high-performance mixed-signal analog devices such as RF switches, low noise amplifiers, and high frequency VCOs. The sweet spot for RF frequencies on the process is between 1- and 15-GHz. The technology is best applied to RF/mixed-signal applications where a high degree of integration (RF, mixed-signal, logic, EEPROM, passives) and high frequencies are important.

Sapphicon offers a one-stop-shop for creating custom mixed-signal chip designs using SoS process technology. In addition, a range of standard devices are in development. The company targets universities, research Institutions, and defense and aerospace companies. SoS is useful in space applications because it is intrinsically radiation hard and tolerant to cryogenic temperatures. Oki and Magnachip have licensed Peregrine's SoS process, but only for providing high volume foundry services to Peregrine, according to Sapphicon. In contrast, Sapphicon can sell to other customers and can develop new products and technologies on SoS. Andrew Brawley, CEO (40 veteran in the semiconductor industry) Andrew Greatbatch, VP Corporate Development (10 years in the semiconductor industry) Steve Duvall, Director Technology (Ex-Intel) Yash Moghe, Design Engineering Manager (ex-Cochlear) 8 Herb Elliott Ave. Homebush Bay, NSW, 2127 AUSTRALIA Tel: +61-2-9763-4111 Fax: +61-2-9746-1501 www.sapphicon.com

support the company. Scintera has roughly 30 employees. In the 2003 timeframe, Scintera launched a family of Electronic Dispersion Compensation Engine chips capable of compensating for non-linear and linear impairments associated with transmitting 10Gbps over the installed legacy fiber infrastructure in the metro and enterprise market. At that time, competitors included startups Santel, Bigbear, and Phyworks as well as incumbents such as AMCC. After the EDC market opportunity failed to materialize, Scintera shifted its mission to be a provider of semiconductors for wireless communications, applying its technology to solve real-world problems in the wireless cellular infrastructure market. The EDC product line was sold off in late 2007. Scintera's core technology, which hasn't changed significantly since its inception, is Gigahertz Signal ProcessingTM (GSP), a programmable analog signal processing platform that delivers higher performance and lower size and power consumption than traditional DSP solutions. To date, adaptive linearization, commonly used to increase the efficiency and output power of macro base-station power amplifiers, has been very complex and expensive, consumed a large amount of power, and was not applicable to many newer system configurations. Engineers designing broadband transmitters have been forced to use expensive RF components and accept low efficiency, or had to use expensive linearization schemes, with multiple high power ICs, which also increased system design and test cost. Increasing backoff and reducing efficiency to achieve linearity increases the

Scintera

Scintera was formed in August 2001 to develop "intelligent electronic solutions that will revolutionize optical networks." In November 2001, the company closed $8.2 million in Series A funding from August Capital and Sevin Rosen Funds. Other investors include Kleiner, Perkins, Caufield & Byers, and Ridgewood Capital. The original investors have continued to

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operating costs and cost of the power amplifier. Pre-distortion and other linearization techniques are time consuming and/or costly to implement. To address this problem, Scintera has developed the SC1887 Adaptive RF Power Amplifier Linearizer (RFPAL) SoC. With RFPAL, the complex signal processing is done in the RF domain. This results in a simple SoC that offers wide signal bandwidth, broad frequency of operation, and very low power consumption. The SC1887 operates directly at the carrier frequency, and is a breakthrough in size, power, and simplicity for this advanced signal processing function. The SC1887 is the first implementation of Scintera's GSP technology. The SC1887 breaks complexity, power, and cost barriers by offering an easy to use, low power, single package solution that is inserted into transmitter designs directly in line with the power amplifier. The RFin/RFout solution offers standalone operation and requires neither complex software development nor access to baseband signals. As a result, users are able to quickly bring to market linearized power amplifier solutions, in any configuration required, while minimizing development and manufacturing costs. Packaged in a small form factor, 9x9 mm2 plastic package, the SC1887 can be implemented in less than 625 mm2 of board space and is easily integrated directly into power amplifier modules. Consuming less than 600mW, the SC1887 is ideally suited to lower power transmitters such as those being widely deployed in distributed 4G networks.

Operating over the full range of frequencies covering all major cellular infrastructure bands, this flexible solution supports a broad range of modulation standards such as CDMA, WCDMA, TD-SCDMA and OFDMA (WiMax, LTE). The device has an onchip MCU and some DSP functionality to provide a high degree of flexibility. The device targets PAs used in traditional in-cabinet amplifiers, remote radio units, tower mounted power amplifiers, repeaters and booster amplifiers, micro basestations, pico basestations, distributed antenna systems, active antenna systems, and MIMO systems. Today's macro basestations, roughly a million unit market, will be giving way to lower power densely deployed base-stations for 4G networks. Scintera argues that this will result in a significant market opportunity, ranging from pico- to macro-stations, all easily served by its technology. Scintera believes it is the only supplier of a true RF linearization solution. Current DPD solutions from TI, Optichron and others are too expensive, too bulky and too power hungry to server emerging lower power amplifier markets. Scintera also argues that its solution is the easiest to deploy, requiring far less expertise and manpower than other alternatives. SC1887 first silicon was released in late 2008 and first samples were delivered in August 2009 using the same die. The device is fabricated in 0.18u CMOS. The device is designed into products currently in development by leading power amplifier vendors and systems integrators worldwide. Pricing starts in volume at $70 at 100 pieces. Future plans include higher levels of integration for the cellular market and

devices targeting other markets such as military and broadcast. Arthur Reidel, CEO (previously a partner at Lightspeed Venture Partners, co-founder, chairman and CEO of Pharsight (now part of Tripos Int'l), and president and CEO of Sunrise Test Systems, which was acquired by Viewlogic Systems) Scott Gibson, CFO (most recently CFO at Luxim) Bob Koupal, VP of Engineering (previously Sr. Director of Engineering at Micro Linear, which was acquired by Sirenza/RFMD) Rajeev Krishnamoorthy, Ph.D., CTO (previously founder and CEO of TZero and VP, Technology at Iospan Wireless, now part of Intel) Roger Merel, VP of Product Strategy (previously VP of product strategy for Luxtera and director of network strategy for JDS Uniphase) Kris Rausch, VP of Sales and Marketing (previously GM of Sales and Business Development at RFMD) Abhijit Shanbhag, Ph.D., Founder & CTO Emeritus (previously held leadership positions at QUALCOMM and Ericsson, and a Group Leader at Morphics Technology, which was acquired by Infineon) 1154 Sonora Court Sunnyvale, CA 94086 Tel: 408.636.2600 Fax: 408.636.2601 www.scintera.com

Contact us to upgrade to a multi-user electronic license or Semiconductor Times Premium to access our online database of more than 1,700 startups.

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People

Actel President and CEO John East has retired. The Board has formed a committee to conduct a search for a new President and CEO. He will remain in his current role until a new CEO is in place. Analogix has promoted Dr. Ning Zhu to CTO. Previously, Dr. Zhu served as VP of Engineering. CSR has appointed Klaus Buehring to the newly created position of SVP of product development. Buehring will be responsible for the engineering development of all core CSR products, including commercial silicon and core software products. CSR founder and CTO James Collier will continue to head the research organization. Buehring previously was SVP and GM of the RF, Analog & Sensor Group at Freescale and VP & GM of the Power Amplifier Division at Skyworks. eSilicon has appointed Ajay Lalwani as VP, strategic sourcing, a new and key position at the company. Lalwani previously founded Cubic Micro, an international sales and marketing representative firm with offices in the Silicon Valley, Japan and Singapore. He also served as VP of the Application Specific Products Business Unit of Renesas. Before Renesas, he was a senior director, worldwide business development for Chartered. GainSpan, a provider of low-power WiFi ICs, has appointed Greg Winner as President and CEO. Winner previously served as President and CEO of ZeroG Wireless and u-Nav Microelectronics. Former co-founder, President and CEO Vijay Parmar will assume the new role of head of business development. GainSpan recently announced the GS1011 SoC for wireless sensor networks and an updated software developer's kit. In addition, the company's 802.11 b/g sensor reference design recently received

Wi-Fi certification and is the first ultra low-power Wi-Fi design to be certified for enterprise security. Gennum has appointed Greg Miller as CFO. Miller has managed financial organizations at WJ Communications, California Micro Devices, LSI Logic, National Semiconductor and Texas Instruments. Innovalight, a provider of silicon inkbased high efficiency solar cell materials and technology, has hired Boris Mathiszik as VP of worldwide sales. Mathiszik previously was managing director for Asia at BTU International. Innovalight has a development roadmap to ultimately bring conversion efficiencies of solar cells to over 20% using its platform for silicon ink and processing technologies. Innovalight has filed for over 60 patents for silicon ink and high efficiency solar cells using silicon ink processes. www.innovalight.com Joule has appointed Dr. Troy Campione as SVP of Corporate Development. Dr. Campione previously served as SVP of Business Development for Solazyme and GM and VP of Collaborations, Alliances and Licensinga at Symyx Technologies. Joule's Helioculture technology platform incorporates proprietary, genome-engineered organisms and a novel SolarConverter system to directly convert waste CO2 from industrial sources into multiple solar fuels and chemicals via the same cost-efficient process. Numerous end products have been validated to date, with dropin replacement fuels being the first commercial targets. www.joulebio.com Maxwell Technologies has expanded the scope of VP Michael Liedtke's responsibilities to include business development, market intelligence and strategic planning, appointed Van Andrews as VP, ultracapacitor sales and marketing and promoted Jeremy Cowperthwaite to the newly created position of VP, ultracapacitor engineer-

ing. Andrews most recently was VP of North American sales with D-Link and previously was president & CEO of U.S. Robotics. www.maxwell.com Mentor Graphics has named Serge Leef as GM of the System Level Engineering division, VP of New Ventures. Numetrics, provider of a suite of enterprise software tools tailored to the unique needs of system and semiconductor product-development organizations, has named Yee Gan as VP of engineering reporting to Ronald Collett, CEO and co-founder. Gan previously led engineering teams at Sun and Oracle. www.numetrics.com Ozmo Devices, provider of low-power Wi-Fi PAN solutions, has appointed Bill McLean as CEO, replacing Dave Timm. McLean previously was the cofounder and CEO of GloNav, a GPS startup sold to NXP for $110 million in 2008. Previously, he was President and CEO of Anadigm and President, U.S. Operations of Parthus Technologies. www.ozmodevices.com SiPort, a supplier of ICs for digital terrestrial broadcast receivers, has appointed Dr. David Rolston as CEO replacing co-founder and Interim CEO Aiman Kabakibo who will assume a new role, EVP and Founder, responsible for SiPort's products and the handset market segment. Dr. Rolston previously served as chairman and CEO of Forterra Systems and GM and VP of engineering at ATI. www.siport.com Solarflare has appointed Sean Keohane as VP of Sales for the Western U.S. Keohane previously was VP of worldwide sales at Aquantia. SoloPower, a manufacturer of high efficiency thin-film solar photovoltaic (PV) cells and lightweight flexible solar modules, has appointed Tim Harris as President and CEO replacing Lou DiNardo who has served as interim CEO since July 2009. Harris previously

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was CEO and President at Celerity and CEO at Komag. SoloPower has demonstrated 13.4% efficiency on 12 cm2 lab cells and 11.7% efficiency on 178 cm2 cells from its roll-to-roll manufacturing line. Using its CIGS-based flexible cells, SoloPower has developed a flexible module, which has demonstrated aperture efficiency of 10.74%. SoloPower plans to enter high-volume production later in 2010. www. SoloPower.com STMicroelectronics has appointed Tjerk Hooghiemstra as EVP, Chief Administrative Officer reporting to President and CEO Carlo Bozotti. Most recently, he served as EVP at Majid Al Futtaim Group in Dubai (UAE). Tilera has opened a branch office in Yokohama, Japan and has appointed Yoichi Ishige as Country Manager. Ishige previously served in various sales management, marketing and business development roles at Macnica. www.tilera.com XMOS has appointed Charles Cotton as a board member and interim CEO, replacing James Foster, who remains as an advisor to the company. Cotton previously was Executive Chairman of GlobespanVirata and CEO of Virata before its merger with Globespan. He is currently a Director of Solarflare and Staccato and two other companies in California. xmos.com

The round will accelerate the commercialization of 1366's Self-Aligned Cell (SAC) and Direct Wafer technologies. The company has already secured two lead development customers and is actively selling the SAC equipment and process, which features innovative cell texturing and fine line metallization to deliver higher efficiencies with simple, low cost solutions for cell manufacturers. Frank van Mierlo, president. www.1366tech.com Green Plug, developer of digital technology enabling collaboration between electronic devices and their power sources, has closed a Series B investment led by Herald Investments UK, Killik & Co. and Peninsula Venture Partners. While the amount was not disclosed, the Series B pre-money valuation is higher than the company's Series A round, announced in January 2008. Green Plug is applying two-way digital communication to convert power from a universal power source to a device's specific power requirements. Frank Paniagua, Jr., CEO. www. greenplug.us Luminus Devices, developer of high light output PhlatLight LEDs, has closed a round of funding totaling $19 million, led by current investors Argonaut Private Equity, Braemar Energy Ventures, Paladin Capital Group and Stata Venture Partners. This investment creates a fully funded operating plan to increase profitability, maintain minimal debt, support growth and the expansion of Luminus' products and applications. www. luminus.com Newport Media has raised $15 million in Series D financing led by Pinnacle Ventures with participation from previous investors Benchmark Capital, Venrock, Global Catalyst Partners, Oak Investment Partners and DAG. Founded in 2005, Newport Media develops mobile TV SOCs that integrate an RF Tuner, Demodulator and Memory for all major mobile TV standards, includ-

ing DVB-T/H, ISDB-T, FLO and CMMB. Multiple top-tier customers and a host of emerging handset manufacturers in China are producing terminals using the full array of Newport's product line. The company is currently ramping 65nm ICs into high-volume production. Mohy Abdelgany, president and CEO. www.newport mediainc.com NEXX Systems, a provider of semiconductor process equipment focused on wafer level packaging, has filed with the SEC for a $42 million IPO. The company achieved net sales of $22M for the nine months ending Sept. 30, 2009 and a net loss of $318K. Net sales in 2008 and 2007 were $18.3M and $25.7M respectively. NEXX currently offer two product platforms: Apollo, its second-generation sputter deposition system, and Stratus, an electrochemical plating system. Petra Solar, a provider of pole mounted smart grid and solar systems for utilities, has raised $40 million in funding for expansion. Two new investors, Craton Equity Partners and Espírito Santo Ventures, led the latest round with 100% participation from existing investors Element Partners, Blue Run Ventures, OnPoint Technologies (U.S. Army's Venture Fund) and Kuwait's National Technology Enterprises Company (NTEC). Petra Solar has developed a utility-grade solution currently shipping to a US utility. Dr. Shihab Kuran, CEO and President. www.petrasolar.com Quantenna, a provider of ultra-reliable Wi-Fi networking for whole-home entertainment, has raised $15 million in Series D financing from current investors Grazia Equity, Sequoia Capital, Sigma Partners, Southern Cross, Swisscom, and Venrock Associates. The cash infusion will enable the company to accelerate volume production ramp so it can meet rapidly growing customer demand for its Full-11n 4x4 MIMO WiFi chipsets. David French, CEO. www.quantenna.com

Funding & IPOs

1366 Technologies, a silicon photovoltaics company, has closed a $5.15 million financing round led by returning investors Polaris and North Bridge Venture Partners, bringing its total amount raised to $17.55 million. The round was awarded on the heels of signing a $4 million contract with the U.S. Department of Energy's ARPA-E program.

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Zenverge, a developer of advanced media ICs, has raised capital from Motorola Ventures and existing investors DCM and Norwest Venture Partners. The financing will support production of a family of single-chip media ICs based on the Zenverge Entertainment Nexus (ZEN), a new architecture for digital HD convergence. Zenverge's media ICs support transcoding, decoding and encoding of multiple formats at up to 4X HD performance or for up to four simultaneous HD streams, exceeding the capabilities of other media ICs today. Now shipping to qualified customers worldwide, Zenverge ICs are being incorporated into HDTVs, Bluray/DVD players and recorders, settops, media gateways, portable device adapters, PCs and professional/network video equipment. zenverge.com

plier of Ethernet Passive Optical Network (EPON) chipsets and software, for approximately $123 million in cash. Broadcom expects the acquisition to be approximately neutral to earnings. EPON is a technology providing broadband services at up to 10 Gbps over fiber optic cables. EPON represents approximately 94% of the FTTx (e.g. Fiber-to-the-Home) connections in the Asia Pacific region. According to the Dell'Oro Group, the Asia Pacific PON market is expected to grow from 22.8 million to 94.5 million subscribers by 2014, a CAGR of 33% (2009-2014). www.teknovus.com Calisolar has acquired 6N Silicon, an Ontario-based silicon supplier to Calisolar and the solar industry, in a stockfor-stock transaction. In addition, $22.5 million in funding was raised from existing Calisolar and 6N investors. In January 2010, Calisolar began commercial shipments of solar cells. The new funds will be used to increase capacity at the Sunnyvale, California cell manufacturing facility and expand silicon purification operations in Vaughan, Ontario. Calisolar manufactures high-performance solar wafers and cells with technologies that use lower cost silicon feedstock. 6N Silicon has developed a low-temperature process that leverages the use of aluminum as a metal solvent for the cost-effective production of high purity solar grade silicon. Calisolar will tightly integrate 6N Silicon's low-cost, silicon purification techniques into its manufacturing process to deliver high-quality, high-performance solar cells. Together, Calisolar and 6N Silicon have raised approximately $190 million. Investors include Advanced Technology Ventures, Globespan Capital Partners, Good Energies, Hudson Clean Energy, Ventures West and Yaletown Ventures. Roy Johnson, CEO of Calisolar; Paolo Maccario, CEO of 6N Silicon.

www.calisolar.com, 6nsilicon.com

www.

Dialog Semiconductor has purchased power management technology through an asset transaction from Diodes Zetex GmbH. Dialog has also acquired specific Diodes IP rights and an employee team located in Munich, Germany. Terms were not disclosed. Exar has signed a definitive agreement to acquire Neterion, a provider of 10 Gigabit Ethernet network adapter solutions optimized for virtualized data centers with an array of top-tier enterprise server and storage customers, for $10 to $11 million net of cash received. Neterion raised more than $40 million in venture funding. Their product portfolio complements Exar's solutions for hardware accelerated data encryption, compression and deduplication. www.exar.com, www.neterion.com Inbrics has acquired publically traded semiconductor design group, Nexilion (Kosdaq A098400). This strategic move will integrate proprietary mobile TV chipset and SoC technology with Inbrics' products like MID, SoIP and Femtocell and convergence offerings of parent company Insprit (Kosdaq 073130), such as Android, DCD, IP push, 3-Screen Plus and 4G data platforms. This acquisition further solidifies the Korea-based developer 's position at the forefront of the media convergence market. Both Inbrics & Insprit currently have partnerships with global carriers and manufacturers including T-Mobile, SK Telecom, Korea Telecom, China Mobile, China Unicom, Celcom, Samsung, LG, and Kyocera. The company has plans to continue to expand aggressively in the next few years particularly in the U.S., Europe, and China. Bobby Cha, chief marketing officer at Inbrics. www.insprit.com, www. inbrics.com Mentor Graphics has acquired the Virtual Garage product line from

Mergers & Acquisitions

AuthenTec has rejected the unsolicited proposal from UPEK to combine the businesses of AuthenTec and UPEK. UPEK's unsolicited proposal followed within days of a January 23rd letter from AuthenTec to UPEK informing UPEK of AuthenTec's claim that UPEK products infringe five AuthenTec patents. UPEK, a provider of enterprise and consumer biometric fingerprint solutions, had submitted to the Board of AuthenTec a proposal to combine UPEK and AuthenTec in a stock-for-stock merger. AuthenTec stockholders would receive 50% of the common stock of the combined company and a cash dividend of $40 million in aggregate paid out of AuthenTec's cash, cash equivalents and short-term investments. UPEK is a privately held company, with its principal stockholders consisting of Diamondhead Ventures, Earlybird Venture Capital, EDB, Morgan Keegan, Partners Group, Sofinnova Partners and Sofinnova Ventures. Broadcom has signed a definitive agreement to acquire Teknovus, a sup-

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Freescale. Virtual Garage is a software suite that addresses two important topics within the design and management of automotive electrical and electronic systems: the trade-off between valueof-variety and cost-of-complexity caused by optional electronic content; and provision of vehicle-specific design data, such as dynamic electrical schematics, on demand to service networks. Virtual Garage is highly complementary to Mentor's CHS software for electrical systems design and wire harness engineering. Microchip has signed a definitive agreement to acquire Silicon Storage Technology (Nasdaq: SSTI) for $3.00 per share in cash under revised terms, compared to $2.85 per share prior to the amendment. This amendment was in response to an offer made by another party to SST's Strategic Committee on February 19, 2010. This represents an approximate 42.8% premium to the amount that the holders of SST common stock would have received under the previously announced merger agreement between SST and Technology Resources Holdings, and an approximate 61.3% premium to the closing price per share of SST's stock on November 12, 2009. SST has terminated its previously announced merger agreement prior to entering into the definitive agreement with Microchip. Micron has signed a definitive agreement to acquire privately held Numonyx in an all-stock transaction valued at approximately $1.27 billion. Micron will issue 140 million Micron common shares to Numonyx shareholders Intel, STMicroelectronics and Francisco Partners. Up to 10 million additional shares will be issued. The Numonyx Flash memory joint venture was created by ST, Intel and Francisco Partners

on March 30, 2008. Numonyx provides a full complement of integrated NOR, NAND, RAM and Phase Change nonvolatile memory technologies and products. The transaction further strengthens Micron's position as one of the leading memory companies, with a broad portfolio of DRAM, NAND and NOR memory products. Micron would also gain increased manufacturing scale globally. SMSC has acquired substantially all the assets and certain liabilities of Kleer Semiconductor, a designer of high quality, interoperable wireless audio technology, for approximately $5.5 million in cash and additional cash payments of up to $2 million. This transaction brings a robust, high-quality audio and low-power RF capability that will allow consumer and automotive OEMs to integrate wireless audio technology into portable audio devices and sound systems without compromising high-grade audio quality or battery life. Several consumer customers already offer products with Kleer technology, including Sennheiser and TDK. www.smsc.com Synopsys has acquired CoWare, a provider of Electronic System Design software and services. Terms were not disclosed. CoWare brings to Synopsys a range of electronic system design solutions covering processor design, system architecture design, verification, software development, and algorithm design. www.coware.com Synopsys has acquired VaST Systems to extend its virtual prototyping solutions into the automotive and consumer application space. Terms were not disclosed. Synopsys does not expect the transaction to have a material impact on 2010 rev. or earnings per share.

low-power 10GBASE-T PHY solution. Cisco and Intel have announced their support for 10GBASE-T on a wide range of new products, including Cisco Catalyst 4900M, Catalyst 6500 and Nexus 7000 switches and the Intel Ethernet Server Adapter X520-T2, now enabled with dual 10GBASE-T interfaces. www.aquantia.com Black Sand, a specialist in power amplifier technology for wireless applications, previously acquired a patent portfolio related to CMOS PAs from Silicon Labs. Black Sand is developing a 3G CMOS RF PA. John Diehl, CEO. www.blacksand.com Ciranova, the automation technology leader for custom IC physical design, has achieved a record sales year in 2009. The company's bookings tripled over 2008, driven by strong demand in major accounts for the company's Helix analog/mixed-signal floorplanning and placement software for use at advanced technology nodes. 2009 also saw record bookings for Ciranova's PDK support and consulting practice. The company's Python-based interoperable parameterized cell ("PyCell") technology was adopted by several top10 semiconductor companies, including the TSMC iPDK, announced in July 2009. Eric Filseth, CEO. www. ciranova.com GalaxyCore Microelectronics, a leading CMOS Image Sensor (CIS) design company in China, has reached a new milestone with its key foundry partner SMIC and shipped 100,000 8" wafers. GalaxyCore claims to hold more than 40% of the CIS VGA market share and is currently the largest in China. Stanley Zhao, CEO. www.gcoreinc.com Heptagon has shipped its 100 millionth wafer-scale, reflowable lens for CMOS Imaging applications. Almost all of these lenses have been shipped for use in mobile handset cameras. The lens solutions have progressed from simple, but extremely tiny, singlet lenses to

Business & Financials

Aquantia has entered full volume production on the AQ 1002, its flagship

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stacks of lenses enabling high-quality VGA and Megapixel resolutions. With strong continuing demand for current products, and a number of new products ranging from VGA to 8+ megapixel in the pipeline, Heptagon expects to be announcing over 200 million of lenses shipped within the next few quarters and to continue growing from there. Chuck Milligan, CEO, www. heptagon.fi Microtune has shipped more than 150 million MicroTuner chips. NEC Electronics and Renesas Technology announced candidates of the executive team that will be in place following the business integration. NEC and Renesas announced their plan to consolidate the companies' domestic sales operations into Renesas Technology Sales Co., Ltd., whose name will change to Renesas Electronics Sales Co., Ltd. www.necel.com, www.renesas.com Sonics, a pioneer of network-on-chip (NoC) technology, announced that its licensee shipments have exceeded 750 million units worldwide and is on track to reach one billion units by year-end. Xikota Devices, formerly StarRF, has folded. The company was developing CMOS PAs for 2G handsets.

low-to-mid teens, providing a solid platform for chip sales. Consumer electronics are expected to grow in the midsingle digits. China and India, two key emerging markets, are also driving demand. www.sia-online.org North America-based manufacturers of semiconductor equipment posted $1.13 billion in orders in January 2010 and a book-to-bill ratio of 1.20, according to SEMI. The three-month average of worldwide bookings in January 2010 was $1.13 billion, up 24.1% from the final December 2009 level of $912.7 million, and more than three times higher than the $277.2 million in orders posted in January 2009. The threemonth average of worldwide billings in January 2010 was $946.3 million, 11.3% greater than the final December 2009 level of $850.1 million, and 62% more than the January 2009 billings level of $584.2 million. www.semi.org

tions and protocol enhancements to the ISO 18000-7 (DASH7) standard by mid-2010. DASH7 is a wireless sensor networking technology that evolved from the RFID and sensing technologies used in the defense industry. DASH7 is a globally available standard operating in the 433 MHz frequency band that offers 10year battery life, a range of more than two kilometers and a low total cost of ownership. www. dash7.org IBM researchers demonstrated a RF graphene transistor with the highest cut-off frequency achieved so far for any graphene device ­100 GigaHertz. Graphene is a single atom-thick layer of carbon atoms bonded in a hexagonal honeycomb-like arrangement. This accomplishment is a key milestone for the Carbon Electronics for RF Applications (CERA) program funded by DARPA, in an effort to develop nextgeneration communication devices. The high frequency record was achieved using wafer-scale, epitaxially grown graphene using processing technology compatible to that used in advanced silicon device fabrication. The frequency performance of the graphene device already exceeds the cut-off frequency of state-of-the-art silicon transistors of the same gate length (~ 40 GigaHertz).

Emerging Trends

The number of smart electric meters deployed worldwide will rise from a 2009 level of 76 million to reach about 212 million in 2014, according to ABI Research. In the US, $3.4 billion in federal economic stimulus funding was directed to smart grid development in November 2009. The EU recently enacted a "Third Energy Package" in September 2009, which aims to see every European electricity meter "smart" by 2022. It has also been suggested that China will replace 300 million electricity meters over the next five or so years. The DASH7 Alliance, a coalition of organizations promoting a standard for wireless sensor networks, announced that its ranks have swelled to more than 40 participating organizations, including leaders from the semiconductor, supply chain and RFID industries. The Alliance has formed three new industry working groups, launched a new testing and certification program and has plans to introduce five specifica-

Market Research

The SIA reported that worldwide semiconductor sales in 2009 were $226.3 billion, a decline of 9% from 2008 when sales were $248.6 billion. Total sales for 2009 surpassed the SIA forecast of $219.7 billion. December sales were $22.4 billion, an increase of 29% from December 2008, when sales were $17.4 billion. December sales declined by 1.2% from November when sales were $22.7 billion. In 2010, unit sales of PCs and cell phones, which account for approximately 60% of total semiconductor consumption, will grow in the

New Products

Altera announced new innovations that will be incorporated into upcoming 28nm FPGAs. Embedded HardCopy Blocks, a new method for partial reconfiguration, and embedded 28-Gbps transceivers will dramatically improve the density and I/O performance of next-generation Altera FPGAs and further strengthen their competitive position versus ASICs and ASSPs. The new Embedded HardCopy Blocks are customizable hard IP blocks that leverage Altera's HardCopy ASIC capabilities. Partial reconfiguration allows designers

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to reconfigure part of the FPGA while other sections remain running. To date, partial reconfiguration solutions have been time-intensive tasks that required designers to know all of the intricate FPGA architecture details. Altera is simplifying the partial reconfiguration process by building the capability on top of the proven incremental compile design flow in its Quartus II design software. ARM has launched the Cortex-M4 processor to provide a highly efficient solution for digital signal control (DSC) applications. The Cortex-M4 processor features a single-cycle multiply-accumulate (MAC) unit, optimized single instruction multiple data (SIMD) instructions, saturating arithmetic instructions and an optional single precision Floating-Point Unit (FPU). These digital signal control features build upon the technology that characterizes the ARM Cortex-M family of processors, including a 32-bit core capable of 1.25DMIPS/MHz for high performance, Thumb-2 instructions for optimum code density and a Nested Vector Interrupt Controller for outstanding interrupt handling. In addition, the processor features an optional Memory Protection Unit (MPU), low cost debug/trace and integrated sleep states for increased flexibility. For a target frequency of 150MHz, ARM physical IP for the 65nm GLOBALFOUNDRIES 65LPe process enables a standard implementation of the Cortex-M4 processor within just 65K gates and a dynamic power consumption of less than 40µW/MHz. The Cortex-M4 processor has been licensed by five leading MCU semiconductor companies including NXP, ST and TI. Bluespec has announced its Pipelined Architecture Composers library (PAClib), the first parameterized, plug-and-

play building block library for specifying, modeling and synthesizing algorithm and datapath designs. PAClib consists of a set of standard pipeline building blocks, user parameterized by computational functions, structures, buffering and data types. Providing 100% transparency and control of architectures, PAClib enables the rapid creation of a single algorithm specification that can generate many different micro-architectures for rapid architectural exploration. Correct control-logic is automatically generated for each micro-architecture. George Harper, VP of Marketing. www.bluespec.com Broadcom is sampling 40-nm low power 10GBASE-T transceivers, lowering operating power to below 4 watts per port. Dell'Oro Group indicates that over two million 10GbE ports were shipped in 2009, and that 10G copper connections will potentially exceed 14 million ports by 2013. The 40nm 10GBASE-T transceiver family includes the BCM84833 (two ports) and BCM84834 (four ports). Intel and Micron have introduced 25nm NAND technology. Manufactured by IM Flash Technologies (IMFT), Intel and Micron's NAND flash joint venture, the 25nm process produces 8 gigabytes of storage in a single NAND device that measures just 167mm2. For consumer electronics manufacturers, the device provides the highest-density in a single 2 bits-per-cell multi-level cell (MLC) die that will fit an industrystandard, thin small-outline package (TSOP). Samples now; production in Q2. Lime Microsystems has introduced the LMS6002D, a multi-band multi-standard RF transceiver IC designed for small cell base-stations and femtocells, featuring integrated high performance dual ADC and DAC. This device delivers increased levels of integration over the company's analog version, the LMS6002. The frequency agile trans-

ceiver operates at user-selectable frequencies between 375MHz and 4GHz and is suitable for 3G, WiMAX, and LTE operation. Samples now. Dr. Ebrahim Bushehri, CEO. www.l imemicro.com Marvell has introduced the first member of the AVANTA family of broadband optical access solutions for GPON, EPON and 10Gigabit EPON. The first set of products are single chip devices for Single-Family-Unit (SFU) applications, addressing both standards of the passive optical networks: the ITU GPON standard mostly adopted in the U.S. and the European Union, as well as the IEEE EPON standard mostly adopted in major Asia-pacific countries including China. The AVANTA 88F6510 features a high level of integration, including a Gigahertz class CPU, dual-mode PON MAC, Line-rate IPv6-capable programmable packet processor, VoIP, Ethernet Switch and Ethernet PHYs. Sample at the end of March. www.marvell.com MoSys has unveiled a roadmap for its new Bandwidth Engine IC, which will combine MoSys' patented 1T-SRAM high-density embedded memory with its 10 Gbps SerDes I/O technology and an arithmetic logic unit. The Bandwidth Engine promises to deliver unparalleled bandwidth performance in next-gen networking systems for storing, manipulating and accessing packets, control information and statistics at breakthrough rates. This represents an expansion of its business model to become a fabless semiconductor company supplying ICs, in addition to IP. The combination of the high-speed random access of a 1T-SRAM memory core with a serial I/O operating at 10 Gbps will enable a Bandwidth Engine device to provide up to two billion accesses per second, over twice the performance of designs utilizing memory technologies. To further boost system performance, the on-chip ALU will

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allow macro functions to be performed within the Bandwidth Engine, reducing iterations between the other packet processing ICs and a Bandwidth Engine. MoSys expects the Bandwidth Engine to enable up to 4X the throughput, 24X the density, up to 40% lower power and system cost savings of up to 50% compared with today's alternative solutions. Samples of the first Bandwidth Engine ICs in late 2010, with production in Q2'11. Complementary to Bandwidth Engine, MoSys is also introducing the GigaChipTM Interface, an open, CEI-11 compatible chip-to-chip interface to enable highly efficient serial chip-to-chip communications in high-speed networking systems. The Bandwidth engine ICs will feature the GigaChip Interface, which will be designed to achieve 90% payload bandwidth efficiency. MoSys is currently working with partner companies to create an ecosystem that will support the GigaChip Interface. www.mosys.com Nujira demonstrated the most efficient and cost-effective RF power amplifier for 3G/4G, based on Coolteq.L silicon. Nujira will be supplying its Coolteq.L test silicon to top global handset OEMs, PA manufacturers and chipset platform vendors as a development platform and proof of concept. These partners will then be offered the opportunity to integrate Coolteq.L IP into platform ICs or PA modules, allowing them to deliver best-in-class RF transmission efficiency without the need to add a separate power modulator chip. Coolteq.L can double the efficiency of the handset PA, and halve the peak current requirement, which is a major constraint for 4G handsets and USB dongles. Coolteq.L is claimed to be the only self-linearising wideband power optimization technology for handset RF front ends, enabling a smaller, cheaper PA device to be used and delivering

high levels of efficiency using a single PA over 3-5X the bandwidth of a standard design. Nujira test results using the new silicon show that a handset PA with Coolteq.L is twice as efficient during HSUPA and LTE transmissions, and 1.5 times as efficient during W-CDMA transmissions, compared with the same PA without Coolteq. A top five handset OEM has already signed a purchase agreement for the Coolteq.L development platform, and the company is in talks with other major OEMs and basedband and PA chip manufacturers. www.nujira.com Octasic has introduced its second generation Opus2 DSP core, a high-performance, ultra-low power, asynchronous DSP architecture optimized for baseband processing and multimedia transcoding. The Opus2 core, based on Octasic's asynchronous Opus DSP architecture, offers the lowest power consumption available in a fully programmable, high-performance DSP. Opus2 is code compatible with the currently shipping Opus1 core, the DSP processor used in Octasic's Vocallo devices, which are widely deployed as a media processor in voice and video media gateways, and as a baseband processor in multi-carrier GSM basestations. Opus2 doubles the platform's performance, while improving its power efficiency. For example, a single device based on Opus2 can provide all the necessary processing for a complete 64user HSPA+/LTE basestation while consuming less than 2.5W. In addition to basic architecture improvements, Opus2 has been optimized with unique instructions and a dynamically reconfigurable hardware accelerator to efficiently support the air interfaces of the existing 2G and 3G standards, as well as the emerging 4G/LTE standards. Robert Blake, CEO. Percello has unveiled the PRC6100, which is claimed to be the most

integrated digital baseband SoC for residential use. The newest member of the Percello Aquilo Femtocell SoC product line, the PRC61000 enables femtocell vendors to reduce cost, size and power of femtocells, while ensuring security. The PRC6100 supports eight users and offers HSPA+ data rates of 21.6 Mbps downstream and 5.76 Mbps upstream. The PRC6100 maximizes digital integration on a single chip to deliver the lowest cost and greatest security available for an HSPA+ femtocell. The chip contains high speed MIPS24Kc and its peripherals, femtocell L1 engine (FLE) and embedded DDRs. As a result, it does not require any external memory, or digital parts on the board. www.percello.com PLX announced what is believed to be the first working PCIe Gen 3 silicon. PLX will use this device to demonstrate PCIe Gen 3 capabilities to key partners this quarter. General availability of a complete portfolio of PCIe Gen 3 switch products will be offered later this year, all of which are developed on 40nm technology. Enterprise servers and storage products featuring PCIe Gen 3 will be available in 1H'11. www.plxtech.com RF Micro Devices has successfully qualified and released its first high power RF CMOS switch using high-resistivity silicon substrates sourced at a leading silicon foundry. RFMD is leveraging this new process technology, as well as patent-pending design and circuit-related technology developed by RFMD, to introduce a product portfolio of high-performance silicon switchbased products for next-generation 3G and 4G smartphones, as well as other cellular handset, wireless infrastructure, WLAN, CATV/broadband and aerospace and defense applications. www.rfmd.com Sensory has release the NLP-5x speech chip, which is claimed to be the first low-cost speech chip to offer a natural

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language interface. The move from the RSC line of processors to the NLP-5x represents roughly a 5X increase in MIPS and RAM over the company's previous generation. Truly Hands-Free "phrase spotting" allows products to be woken up and controlled by voice, so no button pressing is necessary. In addition to recognizing speech and sounds, the NLP-5x can also produce speech and sounds. To date, Sensory's speech chip families have sold more than 60 million units. Available now; < $2 in die form @ 100Ku/yr. www. sensory.com Silicon Hive has introduced the siliconproven HiveFlex CSP2500 Digital RF Processor for smart phones. The CSP2500 enables fully C-programmable, multi-standard smart phone transceiver platforms targeting EDGE, UMTS, LTE, cdma2000, WiFi and WiMAX technologies. It builds on scalable heterogeneous array architecture, exploiting both thread-level and VLIW parallelism. Jeroen Leijten, CTO. SiliconBlue has introduced the iCE65 P-Series mobileFPGA device family. The P-Series devices extend the iCE65 family architecture by adding performance enhancements such as 30% faster I/O, PLLs and by offering over 12,000 logic cells. These enhancements support applications such as video scaling and multiplexing for multi-display applications up to 720p HD, and complex functions such as timing control and color space manipulation for color reflective displays. Static power consumption remains below 50µA. www.siliconblue tech.com SiliconGate has announced the availability of the silicon-proven SGC67120, the first in a family of synchronous step-down DC/DC converters designed to operate from a 1.8V to 5.5V input and deliver up to 3A to 0.6V

to 3.6V outputs. With an extremely fast 1.5µs response time, this new converter promises to reduce the external capacitor size and overall solution cost for portable applications. www.silicon -gate.com Soitec announced volume production of its new generation of high-resistivity (HR) silicon-on-insulator (SOI) substrates to serve the growing cellular phone and Wi-Fi markets. Soitec recently completed qualification at major customers for volume production. Soitec fined-tuned its HR-SOI process to stabilize the base wafer resistivity in order to meet all cellular electrical specifications. Soitec's Smart Cut technology is used to integrate a high resistivity base wafer enabling low signal absorption below the oxide. This high-resistivity option for SOI wafers enables chip designers to reach unprecedented levels of RF and mixed signal integration. www.soitec.com ST has introduced a 3-axis digital gyroscope that employs a single sensing structure for motion measurement along all three orthogonal axes. Whereas existing 3-axis gyroscope solutions rely on two or three independent sensing structures, even if mounted on the same silicon substrate, ST's concept of sensing all three axes with a single driving mass eliminates any interference between the axes that inherently affects and degrades the output signal. Furthermore, the architecture has allowed ST to house the sensor and the ASIC interface inside an ultra-small 4x4x1mm package. Production at the end of Q2'10; $2.9 at > 200Ku. Benedetto Vigna, Group VP and GM, MEMS, Sensors and High Performance Analog Division. www.st.com Telegent has introduced the TLG1121, its third generation analog mobile TV receiver. The TLG1121 is the first single-chip analog mobile TV receiver based on 65nm CMOS. Telegent's

mobile TV architecture delivers stable picture quality while in transit, at speeds up to 430 km/h. Sampling in Q2. Samuel Sheng, president and CEO. www.telegent.com TI has unveiled its WiLink 7.0 singlechip solution, the first offering to integrate WLAN 802.11n, GPS, FM transmit/receive and Bluetooth. Integrating these capabilities on a true single chip, the 65-nm WiLink 7.0 solution reduces costs by 30%, reduces size by 50% and delivers superior coexistence performance. Sampling now. Devices using the WiLink 7.0 solution are expected to enter the market by the end of 2010. Triad Semiconductor has introduced the TSX1001, the first ARM CortexM0 processor combined with high-resolution, high-precision analog resources: 16-bit ADC and 12-bit DAC and uncommitted op-amps. The TSX1001 is implemented on the Mocha-1 platform, which is based on Triad's silicon-proven via-configurable array (VCA) technology. Reid Wender, VP of marketing. Samples in May. www.triadsemi.com Xilinx has chosen the high-k metal gate high-performance, low-power 28-nm process at TSMC and Samsung Foundry to significantly minimize static power consumption. Compared to the standard high-performance process, the high-performance, low-power process delivers FPGAs that are 50% lower in static power. Xilinx is maximizing the value of the 28nm technology node by choosing a high-performance, low-power process technology, a common scalable architecture across product ranges, and tool innovations so customers will have FPGAs that deliver the ASIC-class capabilities. Initial devices will be available in Q4'10 with initial tools support available in the ISE Design Suite in June. www.xilinx.com/techroadmap

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Licensing & Partnerships

Dialog Semiconductor is working closely with foundry partner TSMC on a bipolar-CMOS-DMOS (BCD) technology specifically tailored to highperformance power management ICs for portable devices. The 0.25u highvoltage process node enables higher voltage functionality to be integrated efficiently into single chip power management ICs. Kovio and Nissan Chemical announced a joint collaboration and development agreement. NCI will commercially produce Kovio's proprietary silicon ink technology and supply Kovio with silicon ink products for its RF products and other strategic applications. NCI will be the exclusive supplier of Kovio's silicon ink products to the display industry in Asia, enabling the introduction of printed silicon electronics as a next-generation low-cost process technology for the manufacturing of thin-film transistor (TFT) backplanes in LCD, OLED and eBook displays. www.kovio.com Nano ePrint is developing all-printed electronic greeting cards in collaboration with Novaliad, to a specification provided by Hallmark subsidiary Tigerprint. The £300k project is supported by grant funding from The Northern Way, a joint initiative between the three northern UK Regional Development Agencies (Yorkshire Forward, Northwest Regional Development Agency and One NorthEast). www.nano eprint.com Silicon Hive B.V. has a technology collaboration with Intel to apply Silicon Hive's parallel processing technology across mobile and embedded segments based on the Intel Atom Processor roadmap. Previously, Intel Capital had led a $7M investment round in Silicon Hive. Silicon Hive licenses applicationspecific IP for imaging, video processing and communications. www. siliconhive.com

TSMC and MAPPER Lithography have revealed that a pre-alpha MAPPER tool located on TSMC's Fab 12 GigaFab is repeatedly printing features previously unachievable using current immersion lithography technology. Over the past several months, TSMC has expanded its Maskless Lithography team and has been working with MAPPER engineers at Fab 12 to integrate electron beam direct write capabilities into manufacturing processes for development of future technology nodes.

calls, send text messages or access data services such as weather or traffic information simply by waving the phone near an NFC tag or smart poster without having to navigate through more cumbersome menus. Cosyphone will be available in early Q3'10. www.insidecontactless.com picoChip has announced that Alpha Networks, Argela, Askey, C&S Micro, Contela and Zyxel are the latest customers to use picoChip's PC302 picoXcell SoC in HSPA+ femtocell designs. These six new customers bring the total number of manufacturers using the picoXcell solution for femtocells to over 20. picoChip claims to be the only company with products currently qualified for major carriers' networks and shipping in volume. The market is moving into volume deployment, with ten carriers now offering commercial service and sixty more in trials. picoChip is the dominant supplier in this fast emerging market. In addition, a number of customers are using picoChip for LTE, TD-SCDMA, GSM and cdma2000 deployments. The company is also shipping in very high volume for WiMAX basestations to a large number of OEMs. Wintegra's WinPath packet processor and LTE software has been chosen by Kyocera as the primary controller for a next generation eNodeB family of LTE base stations. wintegra.com

Design Wins

Arrive's AT4848 SoC has been selected as a key component in Iskra Sistemi's SparkLight ADM16 Next Generation SDH Add/Drop Multiplexer. The AT4848 is a highly integrated and scalable OC-48/STM-16, OC-12/ STM-4 or OC-3/STM-1 Multiservice ADM on a chip. Giovanni Cintorrino, Director of WW Sales. www.arrive technologies.com Dongbu HiTek has begun shipping Switched-Mode Power Supply (SMPS) controller ICs to Grandtek LSI, a fabless analog semiconductor company based in Korea. Targeting laptop/ netbook PC adapters and set-top boxes, the controllers were manufactured using a specialized BCDMOS process at the 0.35u node. Lou Hutter, EVP, Analog Foundry Business Unit. www.dongbuhitek.com INSIDE Contactless announced the first deployment of its portfolio of NFC technologies in a commercially available NFC handset. All three of INSIDE's core NFC offerings -- the MicroRead NFC controller chip, the Open NFC protocol stack and the Wave-Me handset client software -- are working together to enhance the user experience for the Cosyphone, a new NFC mobile phone announced by Sagem Wireless. A connected lifestyle device aimed at the over 50's market, the Cosyphone enables users to make

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SEMICONDUCTOR TIMES

Company Financials

Next Qtr Company Symbol Outlook Actel ACTL Up 2-6% Actions Semi ACTS $6.5-7.5M Amkor AMKR Up 2-6% Anadigics ANAD Flat Analog Devices ADI $635-650M AnalogicTech AATI $21-23M Applied Materials AMAT Up 15-25% ARM (GBP) ARMHY n/a Atmel ATML n/s Audiocodes AUDC n/a AuthenTec AUTH $8-8.4M Avago n/a Up 6-9% Aware AWRE n/a Broadcom BRCM Up 0-5% Cadence CDNS $210-220M CSR CSR $160-175M Dialog DLG Up Diodes DIOD $131-137M Entropic ENTR n/a Evergreen Solar ESLR n/a Ezchip EZCH Up First Solar FSLR n/a Gennum GND Up GSI GSIT $18.3-19.1M Hittite HITT $50-52M Ikanos IKAN $54-58M Int'l Rectifier IRF $225-235M Kopin KOPN n/a MediaTek 2454 n/a Microchip MCHP $258-268M Microtune TUNE $21.5-22.5M Mono Power MPWR $45-49M MoSys MOSY n/a Nanometrics NANO n/a NetLogic NETL n/a NVIDIA NVDA Flat O2Micro OIIM n/a ON Semi ONNN $515-525M PDF Solutions PDFS n/a Pericom PSEM $34-36M Power Integrations POWI $70-74M Quicklogic QUIK n/a Ramtron RMTR n/a Silicon Image SIMG $30-32M Silicon Labs SLAB $120-125M Silicon Motion SIMO Up 0-10% SMIC SMI Up 0-2% SPIL SPIL n/a SST SSTI $67-72M Synopsys SNPS $331-339M Techwell TWLL $19.5-20.5M Tower TSEM $110-115M TranSwitch TXCC $15.5M Trident TRID $85-90M TriQuint TQNT $170-175M UMC UMC Down Verigy VRGY $107-117M Virage Logic VIRL $23.5-24M Vishay VSH $630-670M Vitesse VTSS n/a Wolfson Wlf.l n/a Current Qtr Sales Net Margin 49.7 1 2% 8 -1.1 -14% 668 88.0 -22% 42 -8.0 -19% 603 120.5 20% 21 -4.0 -19% 1849 82.8 4% 85 17.3 20% 344 -76.9 -22% 34 1.3 4% 8 -3.0 -36% 456 38.0 8% 6 5.8 105% 1343 59.2 4% 220 1.8 1% 198 20.4 10% 78 19.9 26% 130 14.2 11% 35 1.0 3% 75 -98.1 -132% 13 14.9 116% 641 141.6 22% 25 3.6 7% 17 2.0 11% 44 13.4 31% 58 -9.1 -16% 210 28.3 13% 33 5.3 16% 907 272.6 30% 250 69.4 28% 21 -1.2 -6% 47 4.7 10% 4 -4.9 -140% 26 -0.3 -1% 70 -37.2 -54% 983 131.1 13% 33 2.1 6% 497 68.0 14% 15 -0.7 -5% 36 2.5 7% 66 9.2 14% 4 -1.9 -44% 14 0.8 6% 36 -64.6 -181% 127 40.3 32% 23 -17.3 -76% 333 -482.0 n/a 521 133.3 26% 73 2.4 3% 330 132.8 40% 23 3.7 16% 101 -31.4 -31% 12 -12.7 -105% 32 -23.4 -73% 193 17.5 9% 868 137.0 16% 106 -6.0 -6% 22 -2.2 -10% 607 28.5 5% 42 -34.0 -82% 28 -3.8 -14% GM 62% 34% 26% 28% 61% 48% 38% 94% 37% 55% 46% 43% 84% 53% 82% 47% 48% 32% 52% 12% 68% 42% 73% 43% 75% 30% 30% 35% 59% 58% 57% 59% 80% 51% 28% 45% 61% 39% 55% 34% 51% 49% 52% 53% 65% 40% 11% 20% 33% 80% 62% 6% 53% 16% 37% 26% 44% 79% 23% 54% 51% Last Qtr Sales Net 47.2 0.9 13 -0.6 616 80.9 37 -12.9 572 105.6 26 -1.0 1526 137.9 75 6.9 318 -17.5 32 0.3 10 -4.2 428 -21.0 6 -1.1 1254 84.6 216 -14.0 210 8.6 59 8.8 122 -4.6 31 -1.2 78 -82.4 11 1.8 481 153.3 21 -4.3 15 2.4 42 12.0 29 -15.5 179 -16.9 32 8.5 1071 367.6 227 44.5 18 -4.4 48 12.6 3 -5.0 26 1.6 42 -3.9 903 107.6 37 0.3 473 29.9 14 -2.8 33 1.4 60 9.2 3 -3.0 12 0.1 37 -15.5 126 22.4 23 -4.7 323 -69.1 518 79.3 71 3.1 338 19.5 18 1.1 80 -30.2 15 -1.5 31 -17.2 173 10.5 853 190.0 97 -12.0 13 -3.2 525.3 2.3 39 -9.5 35 -1.5 Yr-ago Qtr Sales Net 53 -12.5 16 0.5 549 -623.1 45 -36.4 477 24.9 19 -15.4 1333 -132.9 94 17.2 335 -24.4 39 -87.1 12 -1.3 368 6.0 12 5.0 1127 -159.2 227 -1634.1 140 -6.0 52 4.6 87 8.7 30 -118.9 44 -53.8 10 1.0 434 132.8 30 2.2 14 1.5 46 13.6 23 -5.7 190 -189.8 29 1.8 644 89.8 192 72.4 24 0.8 35 3.2 4.0 -6.4 21 -2.6 31 -1.1 481 -147.7 23 -7.4 489 -524.7 14 -79.1 31 1.2 42 -20.7 6 -2.6 16 0.9 59 5.0 99 6.3 32 -8.2 273 -126.1 385 -32.0 58 -36.6 340 52.4 17 1.6 77 n/a 15 -4.3 19 -14.6 149 -34.3 580 -735.0 68 -64.0 11 -2.6 575 -652.3 50 -190.0 37 -2.8 GM 59% 45% 18% 19% 56% 38% 29% 89% 40% 54% 46% 39% 89% 50% 78% 44% 42% 26% 48% 5% 64% 0.5 76% 43% 72% 40% 34% 33% 54% 55% 50% 58% 85% 42% 57% 29% 56% 38% 20% 32% 45% 51% 50% 58% 60% 38% -27% 19% 28% 81% 62% n/a 53% 32% 30% -4% 13% 77% 15% 55% 40% Sales Growth -6% -51% 22% -8% 27% 12% 39% -10% 3% -12% -28% 24% -55% 19% -3% 41% 50% 50% 19% 69% 34% 48% -17% 24% -6% 155% 11% 13% 41% 30% -12% 34% -13% 28% 125% 104% 46% 2% 7% 17% 56% -27% -12% -40% 28% -29% 22% 35% 25% -3% 38% 30% -19% 66% 30% 50% 56% 92% 5% -16% -26% Qtr Ending 4Q09 3-Jan 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 1Q10 30-Jan 4Q09 31-Dec 1Q10 31-Jan 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 4Q09 1-Jan 1Q10 31-Jan 4Q09 31-Dec 4Q09 31-Dec 4Q09 2-Jan 4Q09 1-Jan 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 4Q09 26-Dec 4Q09 30-Nov 3Q10 31-Dec 4Q09 31-Dec 4Q09 3-Jan 2Q10 27-Dec 4Q09 26-Dec 4Q09 31-Dec 3Q10 31-Dec 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 4Q09 2-Jan 4Q09 31-Dec 4Q10 31-Jan 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 2Q10 26-Dec 4Q09 31-Dec 4Q09 2-Jan 4Q09 31-Dec 4Q09 31-Dec 4Q09 2-Jan 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 1Q10 31-Jan 4Q09 31-Dec 4Q09 31-Dec 4Q09 31-Dec 2Q10 31-Dec 4Q09 31-Dec 4Q09 31-Dec 1Q10 31-Jan 1Q10 31-Dec 4Q09 31-Dec 1Q10 31-Dec 4Q09 3-Jan

Copyright 2010, Pinestream Communications, Inc. 52 Pine Street, Weston, Massachusetts 02493 USA Tel 781.647.8800 Fax 781.647.8825 www.pinestream.com [email protected]

SEMICONDUCTOR TIMES

MARCH 2010 / 23

Philadelphia SOX Index

TSMC ­ Foundry Barometer

Micron ­ DRAM Barometer

SanDisk ­ Flash Barometer

Intel

Broadcom

Applied Materials

NVIDIA

Copyright 2010, Pinestream Communications, Inc. 52 Pine Street, Weston, Massachusetts 02493 USA Tel 781.647.8800 Fax 781.647.8825 www.pinestream.com [email protected]

24 / MARCH 2010

SEMICONDUCTOR TIMES

Startups In This Issue

CEITEC S.A. ­ Brazilian Semiconductor Company Eden Park Illumination ­ Microplasma Lighting Systems FlexEl - Rechargeable, Flexible Thin Film Battery Intrinsic-ID - Physically Unclonable Functions (PUF) IP LensVector - Solid-State Optical Lens for Mobile Electronics Linear Signal - Low-Cost Beamforming Antennas Javelin Semiconductor ­ 3G CMOS PAs for Handsets Suvolta - JFET Technology Sapphicon - Silicon-on-Saphire (SoS) Foundry & Services Scintera - Adaptive RF Power Amplifier Linearizer SoC

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