Read Reliability Report text version

FFD 3.5" Ultra320 SCSI

Reliability Report

JANUARY 2006 43-QRP-0003 Rev. A

DOCUMENT CONTROL INFORMATION

DCO No: Issued by: Approved by: Title Quality and Reliability Engineer Product Manager, Embedded Name Miri Factor Guy Freikorn Date 31/01/06 2/02/06

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TABLE OF CONTENTS

1 General................................................................................................................................... 4 1.1 1.2 1.3 2 3 4 Introduction .................................................................................................................... 4 Purpose .......................................................................................................................... 4 Applicability .................................................................................................................... 4

Definitions.............................................................................................................................. 5 Reliability Prediction Summary ........................................................................................... 6 Method ................................................................................................................................... 7 4.1 4.2 4.3 Reliability Prediction Method .......................................................................................... 7 General Assumption....................................................................................................... 7 Analysis Performance Method ....................................................................................... 8

5

Additional Documents and Forms....................................................................................... 8

A. Assembly Composite Report ............................................................................................... 9 B. Pareto Analysis (by Item Code) ......................................................................................... 13 How to Contact Us .................................................................................................................... 14

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1 GENERAL

1.1 Introduction

The reliability figure of merit most often used for electronic equipment is Mean Time Between Failures (MTBF). M-Systems estimates MTBF using a prediction methodology based on reliability data for the individual components in M-Systems products. Component data comes from several sources: device life tests, failure analysis of earlier equipment, device physics, and field returns. M-Systems uses two methods to predict reliability: · · Telcordia Special Report SR-332, Reliability Prediction Procedure for Electronic Equipment (RPP). British Telecom Industry HRD5, Handbook of Reliability Data for Electronic Components used in Telecommunication System.

1.2 Purpose

The purpose of the analysis is to present the predicted MTBF, based on Parts Count Method of Telcordia Special Report SR-332, for components failure rates prediction.

1.3 Applicability

The document is applicable for the FFD US320 1/2/4/8/16/64/128/160/224/256/320/352 GB.

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2 DEFINITIONS

Table 1 defines the terminology used in this document.

Table 1: Document Terms Term Failure Failure rate Definition The event, or inoperable state, in which any item or part of an item does not, or would not, perform as previously specified. The total number of failures within an item population, divided by the total number of life units expended by that population, during a particular measurement interval under stated condition. Failures In Time: the number of failures in 1 billion hours. Part per million: the number of failures in 1 million hours. A basic measure of reliability for repairable items: The mean number of life units during which all parts of the item perform within their specified limits, during a particular measurement interval under stated conditions.

FIT PPM Mean Time Between Failures (MTBF)

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3 RELIABILITY PREDICTION SUMMARY

Table 2 summarizes the MTBF prediction results for various SATA configurations. The analysis was performed using a RAM CommanderTM failure rate prediction.

Table 2: Reliability Prediction Results for Product FFD US320 1/2/4/8/16/64/128/160/224/256/320/352 GB. MTBF (Hours) 1.1993 2.1119 3.1679 3.8577 4.9137 5.6035 6.6595 7.3493 Failure Rate per million Hours 833,819.73 473,507.27 315,666.53 259,221.82 203,512.63 178,459.89 150,161.42 136,067.38

Product FFD 3.5" US 320 1/2/4/8/16 GB FFD 3.5" US 320 64 GB FFD 3.5" US 320 128 GB FFD 3.5" US 320 160 GB FFD 3.5" US 320 224 GB FFD 3.5" US 320 256 GB FFD 3.5" US 320 320 GB FFD 3.5" US 320 352 GB

Condition Telcordia SR-332, GB, 25°C Telcordia SR-332, GB, 25°C Telcordia SR-332, GB, 25°C Telcordia SR-332, GB, 25°C Telcordia SR-332, GB, 25°C Telcordia SR-332, GB, 25°C Telcordia SR-332, GB, 25°C Telcordia SR-332, GB, 25°C

The following graphs describe the effect of the temperature rise on the product failure rate:

Graph 1: Temperature Curve for Product FFD 3.5" Ultra Scsi 320 16GB

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4 METHOD

4.1 Reliability Prediction Method

The reliability prediction was performed in accordance with the Telcordia Special Report SR332. The prediction is based on a Parts Count analysis and slight Part Stress Analysis. Quality levels were defined as industrial grade (II) for critical components and grade (I) for all other components. The detailed prediction for the system was performed at a temperature of 25°C in a GB/GF environment. Remark: GB ­ Ground, Fixed, Controlled: Nearly zero environmental stress with optimum engineering operation and maintenance. Typical applications are central office, environmentally controlled vaults, environmentally controlled remote shelters, and environmentally controlled customer premise area. GF ­ Ground, Fixed, Uncontrolled: Some environmental stress with limited maintenance. Typical applications are manholes, poles, remote terminals, and customer premise areas subject to shock, vibration, temperature, or atmospheric variations. It must be emphasized that the basic reliability parameter calculated here does not reflect the mission reliability. For this purpose, the MTBCF (Mean Time Between Critical Failures) has to be extracted from the MTBF. This extraction is to be made through other reliability analyses like FMECA if there is some need to analytically demonstrate a better fulfillment of the requirements.

4.2 General Assumption

The prediction method shares several assumptions: · · · During the useful life of a product, the failure rates of the individual components are constant. The failures of different components are considered statistically independent. The base failure rate for a component is its failure rate at a reference temperature and electrical stress. The base failure rate of a component is multiplied by thermal and electrical stress acceleration factors to find its failure rates in the product. The assembly reliability model is a series one ­ failure in any component causes an assembly failure. Only hardware failures were taken into consideration in the reliability prediction.

· ·

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4.3 Analysis Performance Method

The following steps were provided for proper calculation of MTBF: a) b) A Bill of Materials is prepared for each product configuration. All components used in the design are classified into groups (i.e. resistors, ceramic capacitors, small-signal transistors and diodes, power FETS, and connector pins). Each of these categories is assigned a failure rate that is determined by the type of component and the typical stresses applied to components in that group by the company's design guidelines. The failure rates of individual components are adjusted to use conditions. The reliability estimate for the overall product design is then determined by summing the assumed failure rates for each component used.

c) d)

5 ADDITIONAL DOCUMENTS AND FORMS

Table 3: Additional Documents and Forms Document/Form Name Catalogue Number Issue 1

Telcordia SR-332 prediction model Components Data Sheets

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A.

ASSEMBLY COMPOSITE REPORT

Project name: US320_128G Assembly Ref.Des.: US320_128G, ID: 1, Description: . Environment: GB, Temperature: 25.00 °C,F.R.(xE-6 ): 3.20 ID

1.1 1.2

PN

43A11021500B 43A29832500B

RefDes

, MTBF(hours): 312078.70 F.R. Contrib. Qty xE-6 F.R.(K,Qty) to xE-6 NHA[%]

1 1 1.46 1.75 1.46 1.75 45.48 54.52

Assembly Ref.Des.: , ID: 1.1, Description: SA US320 CPU 32768M 80P (2G FL.* 16 CHIP) SAM-70N IND W/O CONNECTOR IN PS. Environment: GB, Temperature: 25.00 °C,F.R.(xE-6 ): 1.46 , MTBF(hours): 686143.39 F.R. Contrib. ID PN RefDes Qty xE-6 F.R.(K,Qty) to xE-6 NHA[%]

1.1.1 1.1.2 1.1.3 1.1.4 1.1.5 1.1.6 01-CN-122-00 K9WAG08U1M RC_0OHM_1/16 W RC_ 5.1 K_1/16 W 43-SD-200-01 GE28F160C3TD70 JP100 U23,U25,U26, R382,R385,R3 R64,R67,R70, 1 16 8 4 1 1 0.007586 0.02786 0.0003780 0.0003780 0.9739 0.02567 0.007586 0.4457 0.003024 0.001512 0.9739 0.02567 0.52 30.58 0.21 0.10 66.83 1.76

Assembly Ref.Des.: , ID: 1.1.5, Description: COMMON PARTS USCSI 320 CPU 80 PIN MISSING CONNECTOR J1 01-CN-321-00. Environment: GB, Temperature: 25.00 °C,F.R.(xE-6 ): 0.9739 , MTBF(hours): 1026753.51 F.R. Contrib. ID PN RefDes Qty xE-6 F.R.(K,Qty) to xE-6 NHA[%]

1.1.5.1 1.1.5.2 1.1.5.3 1.1.5.4 1.1.5.5 1.1.5.6 1.1.5.7 1.1.5.8 1.1.5.9 1.1.5.10 1.1.5.11 1.1.5.12 1.1.5.13 1.1.5.14 1.1.5.15 1.1.5.16 1.1.5.17

9

10 NF_16V_X7R 0.1UF_10V_X7R 0.1UF_10V_X7R 0.1UF_10V_X7R 1NF_16V_X7R 1NF_16V_X7R 2.2NF_16V_X7R 10UF_6.3V_X7R 22PF_50V_NPO 330PF_16V_ X7R 10PF_50V_NPO 470PF_50V_X7R 2.2UF_10V_X7R 1UF_X7R_10V CLP-108-02-L-D-P-TR 511-240-94-7028 EH3600ETTS-

C5,C10,C22,C C53,C83-5,C2 C190-C201,C2 C4,C13,C14,C C43,C124,C17 C7,C11,C43,C C149 C9,C18,C19,C C31,C106,C17 C236 C101,C104,C1 C115,C246,C2 C206,C231,C2 C3,C6,C12,C4 P1 J2 Y2

Reliability Prediction - FFD US320, Reliability Report

53 11 51 92 10 11 1 4 3 1 3 3 3 22 1 1 1

0.0002732 0.0009109 0.0002453 0.0004537 0.0002732 0.0009109 0.0001860 0.0003784 0.0001537 0.0002732 0.0001537 0.0001537 0.0009109 0.0004537 0.03793 0.007586 0.06

0.01448 0.01002 0.01251 0.04174 0.002732 0.01002 0.0001860 0.001514 0.0004611 0.0002732 0.0004611 0.0004611 0.002733 0.009982 0.03793 0.007586 0.06

43-QRP-0003 Rev. A

1.49 1.03 1.28 4.29 0.28 1.03 0.02 0.16 0.05 0.03 0.05 0.05 0.28 1.02 3.89 0.78 6.16

ID

PN

40.00MTR 636L2I050M00000 1UF_16V 4.7UF_16V 68MF_16V 68UF_16V 220MF_10V RB411D-T146 SML-310DTT86 KPT-1608SURCK 1N5819HW B340LA KPBA-3010ESGC ILBB-0805150 +/-25 UCC5672PWP ADM3222ARU MPC8250ACZQIHBC MIC5159BM6 MIC2193BM FAS662-BAC4 LTC3414 LTC4210-1IS6 MIC2585-2JBTS IDT74LVCH32245ABF NC7WZ16P6X 74ALVCH32501BF IDT2309NZ-1HPGI K4S281632F-TI75 EP1C6F256I7 IHLP-2525CZ-01 Si4403BDY FDS8928A-TF 01-QQ-022-00 FDS6812A EXBD10C103J RC2012J0000CS RC_ 0. OHM_1/8W RC_0OHM_1/16 W RC_5.1K_1/16 W RC_10K_1/16W RC_33OHM_1/16W RC_100K_1/16W RC_10OHM_1/16W RC_12 KOHM_1/16W RC_1KOHM_1/16W RC_51OHM_1/16W RC_22OHM RC_330OHM

RefDes

Qty

F.R. xE-6

Contrib. F.R.(K,Qty) to xE-6 NHA[%]

0.06 0.002459 0.007502 0.0003842 0.004535 0.001386 0.00398 0.0008128 0.0008128 0.00398 0.00796 0.001626 0.001134 0.09176 0.02725 0.005379 0.01454 0.02009 0.0237 0.01738 0.01454 0.02329 0.009185 0.02933 0.02742 0.005379 0.08888 0.02378 0.0007559 0.01327 0.02653 0.02653 0.0398 0.04997 0.0003780 0.0007892 0.01928 0.00189 0.02835 0.01058 0.0007559 0.001512 0.001512 0.00378 0.002268 0.00189 0.001949 6.16 0.25 0.77 0.04 0.47 0.14 0.41 0.08 0.08 0.41 0.82 0.17 0.12 9.42 2.80 0.55 1.49 2.06 2.43 1.78 1.49 2.39 0.94 3.01 2.81 0.55 9.13 2.44 0.08 1.36 2.72 2.72 4.09 5.13 0.04 0.08 1.98 0.19 2.91 1.09 0.08 0.16 0.16 0.39 0.23 0.19 0.20

1.1.5.18 1.1.5.19 1.1.5.20 1.1.5.21 1.1.5.22 1.1.5.23 1.1.5.24 1.1.5.25 1.1.5.26 1.1.5.27 1.1.5.28 1.1.5.29 1.1.5.30 1.1.5.31 1.1.5.32 1.1.5.33 1.1.5.34 1.1.5.35 1.1.5.36 1.1.5.37 1.1.5.38 1.1.5.39 1.1.5.40 1.1.5.41 1.1.5.42 1.1.5.43 1.1.5.44 1.1.5.45 1.1.5.46 1.1.5.47 1.1.5.48 1.1.5.49 1.1.5.50 1.1.5.51 1.1.5.52 1.1.5.53 1.1.5.54 1.1.5.55 1.1.5.56 1.1.5.57 1.1.5.58 1.1.5.59 1.1.5.60 1.1.5.61 1.1.5.62 1.1.5.63 1.1.5.64

Y1 C2,C56,C57,C C29,C34,C47, C17 C8 C1 D9 D6 D3 D1 D5,D7 D2,D4 L4,L5,L6 U104,U105,U1 U111 U7 U101 U3 U18 U1 U5 U102 U10,U14 U4,U6,U17,U1 U13,U28 U16 U9,U15,U24,U U27 L1,L2 Q6 Q1,Q2 Q100,Q101 Q3,Q4,Q5 RN1,RN2,RN3, L3 R2,R3,R12,R2 R14,R75,R83, R58,R63,R65, R7,R8,R25,R3 R100,R104,R1 R194,R195 R50,R53,R129 R29,R112,R19 R101,R131,R1 R102,R114,R1 R41,R42,R43, R10,R17,R116

1 9 6 1 1 1 1 1 1 1 2 2 3 3 1 1 1 1 1 1 1 1 2 7 2 1 6 1 2 1 2 2 3 12 1 4 51 5 75 28 2 4 4 10 6 10 5

0.06 0.0002732 0.00125 0.0003842 0.004535 0.001386 0.00398 0.0008128 0.0008128 0.00398 0.00398 0.0008128 0.0003780 0.03059 0.02725 0.005379 0.01454 0.02009 0.0237 0.01738 0.01454 0.02329 0.004593 0.004191 0.01371 0.005379 0.01481 0.02378 0.0003780 0.01327 0.01327 0.01327 0.01327 0.004164 0.0003780 0.0001973 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003898

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ID

1.1.5.65 1.1.5.66 1.1.5.67 1.1.5.68 1.1.5.69 1.1.5.70 1.1.5.71 1.1.5.72 1.1.5.73 1.1.5.74 1.1.5.75 1.1.5.76 1.1.5.77 1.1.5.78

PN

RC_2.2K CR_10K RC_6.04K RC_10OHM RC_46.4K RC_150_OHM RC_0.015 OHM_0.5W RC_100OHM_1/16W RC_18.2K_1/16W RC_15KOHM_1/16W RC_3.01K_1/16W RC_20K_1/16W RC_100OHM_1/4W RC_2.49KOHM_1/16W

RefDes

R11,R244 R1,R180,R193 R128 R13,R21,R307 R179 R9,R15,R18 R19 R6,R146 R139 R28,R113 R285 R62,R111,R31 R127 R164

Qty

2 5 1 4 1 3 1 2 1 2 1 3 1 1

F.R. xE-6

0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780 0.0003780

Contrib. F.R.(K,Qty) to xE-6 NHA[%]

0.0007559 0.00189 0.0003780 0.001512 0.0003780 0.001134 0.0003780 0.0007559 0.0003780 0.0007559 0.0003780 0.001134 0.0003780 0.0003780 0.08 0.19 0.04 0.16 0.04 0.12 0.04 0.08 0.04 0.08 0.04 0.12 0.04 0.04

Assembly Ref.Des.: , ID: 1.2, Description: SA US320 MEMORY 98304M (2048M FL.* 48 CHIP) SAM70N IND. Environment: GB, Temperature: 25.00 °C,F.R.(xE-6 ): 1.75 , MTBF(hours): 572443.05 F.R. Contrib. ID PN RefDes Qty xE-6 F.R.(K,Qty) to xE-6 NHA[%]

1.2.2 1.2.3 1.2.4 1.2.5 1.2.6 1.2.7 1.2.8 1.2.9 NC7WZ16P6X 74ALVCH32501BF NC7WZ04P6X K9WAG08U1M RC_0OHM_ 1/16 W RC_1KOHM_1/16W 43-SD-201-00 43-SD-202-00 U1,U6,U12,U1 U2,U11,U20 U13 U3,U4,U7,U15 R1,R5,R17,R2 R2,R6,R19,R7 24 3 1 48 32 12 1 1 0.004191 0.01371 0.004208 0.02786 0.0001973 0.0002410 0.2143 0.04038 0.1006 0.04112 0.004208 1.34 0.006314 0.002892 0.2143 0.04038 5.76 2.35 0.24 76.54 0.36 0.17 12.27 2.31

Assembly Ref.Des.: , ID: 1.2.8, Description: COMMON PARTS USCSI320 MEMORY CS. Environment: GB, Temperature: 25.00 °C,F.R.(xE-6 ): 0.2143 , MTBF(hours): 4665365.03 F.R. Contrib. ID PN RefDes Qty xE-6 F.R.(K,Qty) to xE-6 NHA[%]

1.2.8.1 1.2.8.2 1.2.8.3 1.2.8.4 1.2.8.5 1.2.8.6 1.2.8.7 1.2.8.8 1.2.8.9 1.2.8.10 1.2.8.11 1.2.8.12

11

10 NF_16V_X7R 0.1UF_10V_ X7R 330PF_10V_X7R 1UF_10V_X7R 53671-0804 T/R 22UF_10V NC7SZ32P5X IDT74LVCH32245ABF IDT74LVCH32245ABF 74ALVCH32501BF IDT2309NZ-1HPGI NC7WZ04P6X

C69,C70 C1,C4,C5,C10 C58 C2,C32,C34,C JP1 C6,C7,C92,C1 U25,U27 U19 U5,U18,U38,U U10 U21,U34 U9,U26

Reliability Prediction - FFD US320, Reliability Report

2 91 1 20 1 5 2 1 7 1 2 2

0.0002732 0.0004537 0.0004537 0.0004537 0.007586 0.002919 0.004199 0.004593 0.004593 0.01371 0.005379 0.004208

0.0005463 0.04129 0.0004537 0.009074 0.007586 0.01459 0.008398 0.004593 0.03215 0.01371 0.01076 0.008415

43-QRP-0003 Rev. A

0.25 19.26 0.21 4.23 3.54 6.81 3.92 2.14 15.00 6.40 5.02 3.93

ID

1.2.8.13 1.2.8.14 1.2.8.15 1.2.8.16 1.2.8.17 1.2.8.18

PN

AT25128N-10SI-2.7 EPM7128AETI100-7 RC_0 OHM_1/16 W RC_10 K_1/16W RC_10 K_1/16W RC_1KOHM_1/16W

RefDes

U14,U23 U8 R4,R10,R13,R R60 R9,R11,R12,R R3,R7,R18,R4

Qty

2 1 47 1 10 12

F.R. xE-6

0.008776 0.02237 0.0003780 0.0001973 0.0002013 0.0002410

Contrib. F.R.(K,Qty) to xE-6 NHA[%]

0.01755 0.02237 0.01776 0.0001973 0.002013 0.002892 8.19 10.44 8.29 0.09 0.94 1.35

Assembly Ref.Des.: , ID: 1.2.9, Description: COMMON PARTS USCSI320 MEMORY PS. Environment: GB, Temperature: 25.00 °C,F.R.(xE-6 ): 0.04038 , MTBF(hours): 24766379.45 F.R. Contrib. ID PN RefDes Qty xE-6 F.R.(K,Qty) to xE-6 NHA[%]

1.2.9.1 1.2.9.2 1.2.9.3 0.1UF_10V_X7R 1UF_10V_X7R RC_0OHM_1/16 W C202,C203,C2 C200,C201,C2 R200,R201,R2 41 0.0004537 28 0.0004537 24 0.0003780 0.0186 0.0127 0.009071 46.07 31.46 22.47

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B.

PARETO ANALYSIS (BY ITEM CODE)

Project name: US320_128G Start from: US320_128G

Item code IC-Memory IC-Digital Capacitor IC-Analog Resistor Crystal LF Transistor Connector LF Diode Optoelectronic Inductive

Qty 73 59 474 9 395 2 8 4 4 4 5

Total Item code F.R. Cumulative Failure rate contribution contribution 1.915 59.758% 59.758% 0.370 11.561% 71.320% 0.221 6.900% 78.220% 0.209 6.518% 84.738% 0.181 5.653% 90.391% 0.120 3.745% 94.136% 0.106 3.312% 97.449% 0.061 1.894% 99.343% 1.592E-002 0.497% 99.840% 3.251E-003 0.101% 99.941% 1.890E-003 0.059% 100.000%

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HOW TO CONTACT US

USA M-Systems, Inc. 555 North Mathilda Avenue, Suite 220 Sunnyvale, CA 94085 Phone: +1-408-470-4440 Fax: +1-408-470-4470 China M-Systems China Ltd. Room 121-122 Bldg. 2, International Commerce & Exhibition Ctr. Hong Hua Rd. Futian Free Trade Zone Shenzhen, China Phone: +86-755-8348-5218 Fax: +86-755-8348-5418 Europe M-Systems Ltd. 7 Atir Yeda St. Kfar Saba 44425, Israel Tel: +972-9-764-5000 Fax: +972-3-548-8666 Internet www.m-systems.com General Information [email protected] Sales and Technical Information [email protected]

Japan M-Systems Japan Inc. Asahi Seimei Gotanda Bldg., 3F 5-25-16 Higashi-Gotanda Shinagawa-ku Tokyo, 141-0022 Phone: +81-3-5423-8101 Fax: +81-3-5423-8102 Taiwan M-Systems Asia Ltd. 14 F, No. 6, Sec. 3 Minquan East Road Taipei, Taiwan, 104 Tel: +886-2-2515-2522 Fax: +886-2-2515-2295

© 2003 M-Systems Flash Disk Pioneers, Ltd. All rights reserved. This document is for information use only and is subject to change without prior notice. M-Systems Flash Disk Pioneers Ltd. assumes no responsibility for any errors that may appear in this document. No part of this document may be reproduced, transmitted, transcribed, stored in a retrievable manner or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without prior written consent of M-Systems. M-Systems products are not warranted to operate without failure. Accordingly, in any use of the Product in life support systems or other applications where failure could cause injury or loss of life, the Product should only be incorporated in systems designed with appropriate and sufficient redundancy or backup features. Contact your local M-Systems sales office or distributor, or visit our website at Hwww.m-sys.comH to obtain the latest specifications before placing your order. DiskOnChip®, DiskOnChip Millennium®, DiskOnKey® and TrueFFS® are registered trademarks of M-Systems. FFDTM and SuperMAPTM are trademarks of M-Systems. Other product names mentioned in this document may be trademarks or registered trademarks of their respective owners and are hereby acknowledged.

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